Abstract: Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.

Abstract: A microelectronic device comprises a stack structure, a stadium structure within the stack structure, and conductive contact structures. The stack structure comprises a vertically alternating sequence of conductive structures and insulative structures arranged in tiers. Each of the tiers comprises one of the conductive structures and one of the insulative structures. The stadium structure comprises a forward staircase structure having steps comprising edges of the tiers, and a reverse staircase structure opposing the forward staircase structure and having additional steps comprising additional edges of the tiers. The conductive contact structures vertically extend to upper vertical boundaries of at least some of the conductive structures of the stack structure at the steps of the forward staircase structure and the additional steps of the reverse staircase structure, and are each integral and continuous with one of the conductive structures.

Abstract: Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.

Abstract: This present invention relates to a dual head screw that features at least one male nut driver extending outwardly from a base head opposite the shaft of the screw. The dual head screw replaces standard female head screws, thus eliminating concern over stripping of the screw head or the same becoming compacted with debris. The dual head screw has a shaft with a threaded section, a base head and the male nut driver. The male nut driver is dimensioned in size to withstand the torsional forces associated with installing or extracting the dual head screw from an object, and may be driven or extracted with a standard hand tool or a power drill. In a further embodiment, the male nut driver may be comprised of a first driving portion and a second driving portion.

Abstract: Devices and methods for adjusting the position of liquid cooling system infrastructure of a computing system comprising liquid-cooled memory modules to provide improved systems and techniques for servicing liquid-cooled memory modules are disclosed herein. According to an aspect, a device includes a table section, a handle on a first side of the table section, and a spreader section on a second side of the table section opposite from the first side, the spreader section further comprising a profile. The profile of the spreader section comprises a first pair of a flat surfaces parallel to each other, defining a first width. The profile of the spreader section further comprises a second pair of flat surfaces parallel to each other, defining a second width perpendicular to the first width, the second width being longer than the first width.

Abstract: Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.

Abstract: Devices and methods for adjusting the position of liquid cooling system infrastructure of a computing system comprising liquid-cooled memory modules to provide improved systems and techniques for servicing liquid-cooled memory modules are disclosed herein. According to an aspect, a device includes a table section, a handle on a first side of the table section, and a spreader section on a second side of the table section opposite from the first side, the spreader section further comprising a profile. The profile of the spreader section comprises a first pair of a flat surfaces parallel to each other, defining a first width. The profile of the spreader section further comprises a second pair of flat surfaces parallel to each other, defining a second width perpendicular to the first width, the second width being longer than the first width.

Abstract: An electrical connector system includes a cap, a printed circuit board, and a tray. The cap includes a plurality of hinge pins disposed on transverse sides of the cap, a plurality of cap mounting holes that extend through the cap, a cap light cutout portion, and a plurality of cap retention features. The printed circuit board includes a plurality of printed circuit board mounting holes, a printed circuit board light cutout portion, a plurality of printed circuit board electrical contacts, and a plurality of pogo-pins that are electrically connected to the corresponding plurality of printed circuit board electrical contacts. The tray includes a plurality of hinge pin receivers formed in transverse sidewalls of the tray, a tray mounting surface, and a plurality of tray retention features. Each hinge pin receiver includes a first portion separated from a second portion by a pin retention feature.

Abstract: An electrical connector system includes a connector and a header. The header includes a substantially T-shaped member having a proximal portion substantially rectangular in shape having a first width and a distal portion substantially rectangular in shape having a second width greater than the first width. A first and a second end portion of the distal portions are substantially T-shaped viewed end on. The first and the second end portions include a plurality of guides and shoulders. The connector includes a substantially rectangular member having a proximal portion having a first thickness and a distal portion having a second thickness less than the first thickness on a bottom side of the substantially rectangular member. The proximal portion includes first and second proximal feet and first and second distal feet. Each foot includes a foot retention shoulder and one or more guides.

Abstract: An electrical connector system includes a connector and a header. The header includes a substantially T-shaped member having a proximal portion substantially rectangular in shape having a first width and a distal portion substantially rectangular in shape having a second width greater than the first width. A first and a second end portion of the distal portions are substantially T-shaped viewed end on. The first and the second end portions include a plurality of guides and shoulders. The connector includes a substantially rectangular member having a proximal portion having a first thickness and a distal portion having a second thickness less than the first thickness on a bottom side of the substantially rectangular member. The proximal portion includes first and second proximal feet and first and second distal feet. Each foot includes a foot retention shoulder and one or more guides.

Abstract: A method and apparatus for a large-way, symmetric multiprocessor system using a bus-based cache-coherence protocol is provided. The distributed system structure contains an address switch, multiple memory subsystems, and multiple master devices, either processors, I/O agents, or coherent memory adapters, organized into a set of nodes supported by a node controller. Each of the processors may have multiple caches. The address switch connects to each of the node controllers and to each of the memory subsystems, and each of the memory subsystems connects to the address switch and to each of the node controllers. The node controller receives commands from a master device and queues commands received from a master device. The node controller has a deterministic delay between latching a snooped command broadcast by the address switch and presenting the command to the master devices on the node controller's master device buses.

Abstract: A method and apparatus in a data processing system having a plurality of node controllers and a memory unit for each of the node controllers. Each one of the node controllers including at least one processor having a cache. Each memory unit including a plurality of entries each having an exclusive bit, an address tag, and an inclusion field. Each bit of the inclusion field representing one of the node controllers. The method and apparatus allow error recovery for errors occurring within the entries without using the ECC implementation. Specifically, two parity bits are used for detecting errors within an entry and logic for flushing any cache lines represented by the entry in error. The method and apparatus also includes means for detecting persistent errors and for indicating whether the error is generated by either hardware or software.