Abstract: System and method for a reduced foot print package with tolerance for thermal and mechanical stresses for integrated circuits. A preferred embodiment comprises a package for an integrated circuit die comprising a plurality of input/output contacts and a die support to hold the integrated circuit die. The die support comprises a plurality of support arms, wherein each support arm is electrically disjoint and having an end with an exposed fuse lead that will be external of the packaged integrated circuit die. The exposed fuse leads can be used to fix the packaged integrated circuit die to a substrate and provide additional bonding strength to increase tolerance to thermal and mechanical stresses.