Abstract: A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.

Abstract: A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Abstract: A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Abstract: A combined alternating current (AC) and direct current (DC) power converter is disclosed. In embodiments, the power converter includes an electromagnetic interference (EMI) filter, a bridge rectifier, and a boost converter. The EMI filter is configured to receive an electrical signal from a power source. The bridge rectifier is coupled to the EMI filter and includes at least four diodes arranged in a diode bridge configuration. The boost converter is coupled to the bridge rectifier and includes a switched DC path and a switched AC path. The switched DC path includes a DC transistor and the switched AC path includes an AC transistor. The switched AC path can also include one or more diodes and/or switching elements.

Abstract: A rotary joint is disclosed. The rotary joint comprise a power transfer interface for transferring power between a first portion having a first magnetic core and a second portion having a second magnetic core and rotatable relative to the first portion. The rotary joint may also comprise a data interface for transferring data between a cable and a second cable that is rotatable relative to the first cable.