Abstract: A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows:1. condition with an oxidant solution;2(A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and2(B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or2(A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhanced catalyst adsorption; and2(B). contact with a copper etchant; and3. catalyze the board; and4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution.The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.