Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

Abstract: A heat sink assembly includes an electronic device, a heat sink and a clip that compresses the heat sink against the electronic device. A spacer is mounted on the clip to restrain motion of the heat sink relative to the electronic device. A method of securing a heat sink to an electronic device includes compressing the heat sink against the electronic device with a clip, and attaching a spacer to the clip in order to restrain motion.

Abstract: A heat sink assembly includes an electronic device, a heat sink and a clip that compresses the heat sink against the electronic device. A spacer is mounted on the clip to restrain motion of the heat sink relative to the electronic device. A method of securing a heat sink to an electronic device includes compressing the heat sink against the electronic device with a clip, and attaching a spacer to the clip in order to restrain motion.

Abstract: A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

Abstract: A phase change ink carrier composition is combined with a compatible colorant to form a phase change ink composition of this invention. A thin film of substantially uniform thickness of that phase change ink carrier composition, and the ink produced therefrom, has a high degree of lightness and chroma. The thin films of a substantially uniform thickness of the ink composition are also rectilinearly light transmissive. The carrier composition is preferably a fatty amide-containing compound.

Abstract: A device for disinfecting and storing endoscopes and the like includes a pair of vertically spaced, wall-mounted brackets between which extend a plurality of parallel connecting rods for supporting the brackets in fixed position relative to each other. A pair of vertically extending tubes for holding disinfecting liquid are locked in position between the brackets by a pair of annular cam-action nuts engaging the top ends of the tubes, the nuts being rotatable to release the tubes for removal and cleaning at a remote location. Elastomeric plugs inserted into the bottom ends of the tubes preclude leakage of disinfecting liquid therefrom. Alternatively, valve assemblies can be provided at the bottom ends of the tubes to permit drainage of the disinfecting liquid from the tubes when in their mounted positions. The uppermost bracket supports the annular nuts which in turn support one or two endoscopes with their insertion portions extending through the annular nuts into the disinfecting liquid within the tubes.