Patents by Inventor Jeffrey James Frye

Jeffrey James Frye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin semiconductor die package
    Patent number: 8618675
    Abstract: A semiconductor die is attached to a substrate by a glass frit layer. Gas that might be trapped between the die and the glass frit layer during firing of the glass frit can escape through passages that are formed against the bottom surface of the die by topographies that extend away from and which are substantially orthogonal to the bottom of the die.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: December 31, 2013
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Xiaoyi Ding, Jeffrey James Frye
  • THIN SEMICONDUCTOR DIE PACKAGE
    Publication number: 20130105999
    Abstract: A semiconductor die is attached to a substrate by a glass frit layer. Gas that might be trapped between the die and the glass frit layer during firing of the glass frit can escape through passages that are formed against the bottom surface of the die by topographies that extend away from and which are substantially orthogonal to the bottom of the die.
    Type: Application
    Filed: October 26, 2011
    Publication date: May 2, 2013
    Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
    Inventors: Xiaoyi Ding, Jeffrey James Frye