Patents by Inventor Jeffrey Jiang

Jeffrey Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component Carrier and Method of Manufacturing the Same
    Publication number: 20260262161
    Abstract: The present application provides a component carrier and a method of manufacturing the same. The component carrier includes a stack having at least one electrically insulating layer structure and at least one electrically conductive layer structure. The stack including an inorganic layer structure, and a reinforcing structure made of crack-inhibiting reinforcing material. The reinforcing structure being provided at least partially at a lateral edge of the inorganic layer structure.
    Type: Application
    Filed: October 5, 2023
    Publication date: September 3, 2026
    Inventors: Hans PARK, Jeesoo MOK, Jeffrey JIANG
  • Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material
    Patent number: 12507350
    Abstract: A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: December 23, 2025
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Jeffrey Jiang, Allen Zhao, Artan Baftiri
  • Manufacturing Component Carrier With Cavity By Trimming Poorly Adhesive Structure Before Removing Stack Material
    Publication number: 20230041145
    Abstract: A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 9, 2023
    Inventors: Jeffrey JIANG, Allen ZHAO, Artan BAFTIRI
  • Mobile phone
    Patent number: D550642
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: September 11, 2007
    Assignee: Inventec Corporation
    Inventors: Jeffrey Jiang, Vincent Cheng, Ether Sheu