Abstract: Detector modules and methods of manufacturing are provided. One detector module includes a detector having a silicon wafer structure formed from a first layer having a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity. The detector further includes a photosensor device provided with the first layer on a first side of the silicon wafer and one or more readout electronics provided with the second layer on a second side of the silicon wafer, with the first side being a different side than the second side.

Abstract: A photodiode assembly includes a semiconductor substrate, a photodiode cell, a ground diffusion region, and a guard band. The photodiode cell includes a first volume of the substrate doped with a first type of dopant. The diffusion region includes a second volume of the substrate that is doped with a second, opposite type of dopant. The guard band is disposed in the substrate and at least partially extends around an outer periphery of the photodiode cell. The guard band includes a third volume of the substrate that is doped with the first type of dopant. At least one of the ground diffusion region or the guard band is conductively coupled with a ground reference to conduct one or more of electrons or holes that drift from the photodiode cell through the substrate. The guard band is disposed closer to the photodiode cell than the ground diffusion region.

Abstract: Detector modules and methods of manufacturing are provided. One detector module includes a detector having a silicon wafer structure formed from a first layer having a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity. The detector further includes a photosensor device provided with the first layer on a first side of the silicon wafer and one or more readout electronics provided with the second layer on a second side of the silicon wafer, with the first side being a different side than the second side.

Abstract: A photodiode assembly includes a semiconductor substrate, a photodiode cell, a ground diffusion region, and a guard band. The photodiode cell includes a first volume of the substrate doped with a first type of dopant. The diffusion region includes a second volume of the substrate that is doped with a second, opposite type of dopant. The guard band is disposed in the substrate and at least partially extends around an outer periphery of the photodiode cell. The guard band includes a third volume of the substrate that is doped with the first type of dopant. At least one of the ground diffusion region or the guard band is conductively coupled with a ground reference to conduct one or more of electrons or holes that drift from the photodiode cell through the substrate. The guard band is disposed closer to the photodiode cell than the ground diffusion region.

Abstract: The present invention generally relates to a method for forming a flat panel for an X-ray detector device. The method comprises forming an active area of a first size on a substrate of a second size and extending at least one contact of the active area. The method further comprises trimming the substrate to the first size forming the flat panel.

Abstract: The present invention generally relates to a method for forming a flat panel for an X-ray detector device. The method comprises forming an active area of a first size on a substrate of a second size and extending at least one contact of the active area. The method further comprises trimming the substrate to the first size forming the flat panel.

Abstract: The present invention relates to a method for forming an active area or flat panel in an X-ray detector device. The method comprises forming at least one flat form factor panel in a first size on a substrate of a second size and extending at least one contact of the at least one flat form factor panel. The method further comprises trimming the substrate to the first size forming the at least one flat panel.

Abstract: The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique minimizes edge gaps between adjacent detector tiles by coupling the detector tiles to the flexible structure and then flexing the flexible structure to close the edge gaps. Intermediate electrical connections, such as interlayer solder bumps, also may be used to minimize visible artifacts associated with tiling of the detector tiles. The present technique also may use a plurality of soldering materials having different melting temperatures to facilitate multiple soldering steps that are nondestructive of previous soldering steps.

Abstract: The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique minimizes edge gaps between adjacent detector tiles by coupling the detector tiles to the flexible structure and then flexing the flexible structure to close the edge gaps. Intermediate electrical connections, such as interlayer solder bumps, also may be used to minimize visible artifacts associated with tiling of the detector tiles. The present technique also may use a plurality of soldering materials having different melting temperatures to facilitate multiple soldering steps that are nondestructive of previous soldering steps.

Abstract: The present invention relates to a system and method by which the magnitude of an interfering electrical and/or magnetic field may be sampled locally (in the X-ray detector for example) and reduced or eliminated. More specifically, embodiments comprise a system and method by which an interfering field may be sampled within the same orientation as the X-ray detector panel, and then subtracted out of each respective element sample.

Abstract: The present invention relates to a system and method by which the magnitude of an interfering electrical and/or magnetic field may be sampled locally (in the X-ray detector for example) and reduced or eliminated. More specifically, embodiments comprise a system and method by which an interfering field may be sampled within the same orientation as the X-ray detector panel, and then subtracted out of each respective element sample.

Abstract: A mammography scanning system having a detector includes an arc-shaped support system having a number of X-ray emitters coupled thereto. The X-ray emitters generate a plurality of X-ray fluxes towards a common focus at varying angles with respect to the focus. Also, each of the X-ray emitters is collimated to view an entire detector field of view.

Abstract: The present invention relates to a method for forming an active area or flat panel in an X-ray detector device. The method comprises forming at least one flat form factor panel in a first size on a substrate of a second size and extending at least one contact of the at least one flat form factor panel. The method further comprises trimming the substrate to the first size forming the at least one flat panel.

Abstract: A temperature regulator provides thermoelectric temperature control in a X-ray detector. The temperature regulator maintains the temperature within the X-ray detector by controlling current through a thermoelectric device. The temperature regulator can both heat and cool the X-ray detector.

Abstract: A method of maintaining an initial bias of an x-ray detector (12) includes setting the initial bias of the x-ray detector. Operating state of a readout circuit (30) is altered. A photodiode common contact voltage potential is adjusted by a data line drift amount to approximately maintain the initial bias. An x-ray imaging system (10) includes a detector (12) that has multiple pixels, multiple data lines (50), and a common contact (62) that is at a common contact voltage potential. The readout circuit (30) is electrically coupled to the data lines (50) and has a multiple power states. A controller (36) is electrically coupled to the readout circuit (30), detects a change in operating state of the readout circuit (30), and adjusts voltage potential of the common contact (62) in response to the change in operating state.

Abstract: An X-ray detector includes a glass layer curved according to a pre-selected radius of curvature, a photoreceptor formed on the glass layer, and a backing layer curved according to the pre-selected radius of curvature. The backing layer supports the glass layer.

Abstract: The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique minimizes edge gaps between adjacent detector tiles by coupling the detector tiles to the flexible structure and then flexing the flexible structure to close the edge gaps. Intermediate electrical connections, such as interlayer solder bumps, also may be used to minimize visible artifacts associated with tiling of the detector tiles. The present technique also may use a plurality of soldering materials having different melting temperatures to facilitate multiple soldering steps that are nondestructive of previous soldering steps.

Abstract: A method and apparatus for calibrating the resolution of a medical imaging system measures unadjusted performance of a digital image detector used in the medical imaging system. The method then determines a weighting coefficient for a spatial frequency band processed by the medical imaging system. The weighting coefficient is based on a desired performance of the digital image detector and the unadjusted performance of the digital image detector. The method stores the weighting coefficient for subsequent application to the spatial frequency band by the medical imaging system. Identical or distinct weighting coefficients may be used at multiple spatial resolution levels. A single weighting coefficient may applied to all pixels at a given spatial resolution, or numerous spatial resolution variation compensation coefficients may be used in different regions of each spatial resolution.

Abstract: A radiographic imaging system includes an X-ray emitter, an X-ray detector, and a network. The X-ray emitter is actuatable to emit an X-ray beam centered about an X-ray beam axis. The X-ray detector has a generally planar configuration and is situated within the path of the X-ray beam to thereby generate an image when the X-ray detector receives the X-ray beam. The network couples at least one of the X-ray emitter and X-ray detector to a remote facility. The network provides the X-ray emitter and the X-ray detector with remote services from the remote facility. A corresponding method is also provided.

Abstract: A radiographic imaging system including a solid state x-ray imager is disclosed. An x-ray tube is supported in a vertical x-ray tube support system alternately or in addition to a overhead angulating x-ray tube support system. A solid state x-ray imager is supported in a wall stand alternately or in addition to an angulating table stand. Associated sensors sense the position of the solid state x-ray imager, and a position controller adjusts the position of the x-ray tube such that the x-ray tube is positioned at the center of the solid state x-ray imager. Readout circuitry receives the analog image from the solid state x-ray imager and transmits the corresponding digital information to a digital processor for image creation or manipulation. The digital image may than be displayed on a digital imager acquisition and display system.