Patents by Inventor Jeffrey Khai Huat Low

Jeffrey Khai Huat Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
    Patent number: 8497158
    Abstract: A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Infineon Technologies AG
    Inventors: Jeffrey Khai Huat Low, Kean Cheong Lee
  • LEADFRAME STRIP AND MOLD APPARATUS FOR AN ELECTRONIC COMPONENT AND METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT
    Publication number: 20130011973
    Abstract: A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 10, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Jeffrey Khai Huat Low, Kean Cheong Lee
  • Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
    Patent number: 8334583
    Abstract: A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: December 18, 2012
    Assignee: Infineon Technologies AG
    Inventors: Jeffrey Khai Huat Low, Kean Cheong Lee
  • Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component
    Publication number: 20080290484
    Abstract: A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
    Type: Application
    Filed: July 20, 2005
    Publication date: November 27, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Jeffrey Khai Huat Low, Kean Cheong Lee