Patents by Inventor Jeffrey Kingan Witt

Jeffrey Kingan Witt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Exposed, solderable heat spreader for integrated circuit packages
    Patent number: 9431319
    Abstract: An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: August 30, 2016
    Assignee: LINEAR TECHNOLOGY CORPORATION
    Inventors: Edward William Olsen, Leonard Shtargot, David Roy Ng, Jeffrey Kingan Witt
  • EXPOSED, SOLDERABLE HEAT SPREADER FOR INTEGRATED CIRCUIT PACKAGES
    Publication number: 20160035644
    Abstract: An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.
    Type: Application
    Filed: February 24, 2015
    Publication date: February 4, 2016
    Inventors: Edward William Olsen, Leonard Shtargot, David Roy Ng, Jeffrey Kingan Witt