Patents by Inventor Jeffrey Kmetec
Jeffrey Kmetec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11975405Abstract: A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the a first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.Type: GrantFiled: November 20, 2018Date of Patent: May 7, 2024Assignee: IPG PHOTONICS CORPORATIONInventors: Pancho Tzankov, Jonathan Ehrmann, Jeffrey Kmetec, Alexey Avdokhin, Andrei Babushkin
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Patent number: 11433483Abstract: A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.Type: GrantFiled: November 20, 2017Date of Patent: September 6, 2022Assignee: IPG PHOTONICS CORPORATIONInventors: Alexey Avdokhin, Pancho Tzankov, Andrei Babushkin, Jonathan Ehrmann, Jeffrey Kmetec
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Publication number: 20200384572Abstract: A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the a first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.Type: ApplicationFiled: November 20, 2018Publication date: December 10, 2020Inventors: Pancho TZANKOV, Jonathan EHRMANN, Jeffrey KMETEC, Alexey AVDOKHIN, Andrei BABUSHKIN
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Patent number: 10490719Abstract: Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single interconnect layer on the substrate upon which the die is mounted.Type: GrantFiled: October 19, 2016Date of Patent: November 26, 2019Assignee: Lumileds Holding B.V.Inventors: Wen Yu, Oleg B. Shchekin, Franklin Wall, Kuochou Tai, Mohiuddin Mala, Robert Zona, Jeffrey Kmetec, Alexander Nickel
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Publication number: 20190329357Abstract: A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.Type: ApplicationFiled: November 20, 2017Publication date: October 31, 2019Inventors: Alexey AVDOKHIN, Pancho TZANKOV, Andrei BABUSHKIN, Jonathan EHRMANN, Jeffrey KMETEC
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Publication number: 20180337315Abstract: Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.Type: ApplicationFiled: October 19, 2016Publication date: November 22, 2018Applicant: Lumileds Holding B.V.Inventors: Wen YU, Oleg B. SHCHEKIN, Franklin WALL, Kuochou TAI, Mohiuddin MALA, Robert ZONA, Jeffrey KMETEC, Alexander NICKEL
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Patent number: 9040332Abstract: A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.Type: GrantFiled: October 7, 2011Date of Patent: May 26, 2015Assignee: Koninklijke Philips N.V.Inventors: Brendan Moran, Jeffrey Kmetec, Iain Black, Frederic Diana, Serge Laurent Rudaz, Li Zhang
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Publication number: 20130248913Abstract: A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.Type: ApplicationFiled: October 7, 2011Publication date: September 26, 2013Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Brendan Moran, Jeffrey Kmetec, Iain Black, Frederic Diana, Serge Laurent Rudaz, Li Zhang
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Publication number: 20110049545Abstract: After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.Type: ApplicationFiled: September 2, 2009Publication date: March 3, 2011Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: Grigoriy Basin, Jeffrey Kmetec, Paul S. Martin
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Patent number: 7638814Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.Type: GrantFiled: June 19, 2007Date of Patent: December 29, 2009Assignee: Philips Lumileds Lighting Company, LLCInventors: Franklin Wall, Jr., Peter Stormberg, Jeffrey Kmetec, Mina Farr, Li Zhang
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Publication number: 20080315214Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.Type: ApplicationFiled: June 19, 2007Publication date: December 25, 2008Applicant: PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: Franklin Wall, JR., Peter Stormberg, Jeffrey Kmetec, Mina Farr, Li Zhang