Abstract: Environmental enhancement by controlling volatile organic compound (VOC) and NO.sub.x emissions in a flatline wafer drying system. The method is characterized by advancing the wafers of the type used in manufacture of oriented strand board (OSB) on a flatline conveyor embodying a plurality of dryer zones. Particularly, heating the dryer zones in successive lower temperatures in the range 500.degree. F. to 200.degree. F. by flowing heated air upwardly through the flatline wafer drying conveyor; removing VOC-rich exhaust air from a primary dryer zone while flowing heated air upwardly therein and removing VOC-rich exhaust air from a secondary dryer zone while flowing heated air from therein.

Abstract: A coater is provided for coating objects with a liquid material. The coater includes a flume that has an entry and an exit end, a supply of liquid coating material upon which the objects float, and a circulation system. The circulation system delivers the liquid material to the entry end of the flume so that the liquid material flows toward and out the exit end. The coater also includes a conveyor that loads the objects into the flume and a conveyor that receives the objects at the exit end of the flume.

Abstract: Drying of particulate materials, such as wood chips (wafers/strands) for the manufacture of oriented structural board, as well as bark, and the like. The method is characterized by advancing wafers in random array and superposed and without contact above a planar surface; forcing heated air upwardly through spaced apart holes defined in the stationary planar surface and through the random array of advancing wafers, while evacuating heated air and accumulated moisture above the advancing wafers. The method is distinguished by lateral shielding during forcing of heated air above the planar surface, so as to inhibit "blow-holes" among the drying wafers.

Abstract: Apparatus and method in which a number of thin, disc-like wafers are moved in an arcuate path while supported in a generally upright position. While so supported, the wafers are indexed between a plurality of cleaning stations which may include a scrub station, a scrub rinse station, a rinse station, and a dry station. In the scrub rinse and/or scrub station, the wafers are rotated while contacted on opposite surfaces thereof by a pair of rotating brushes disposed in a closed position, which brushes may be moved to an open position to accommodate movement of the wafers therebetween. Furthermore, a bracket of unique construction serially moves the wafers into the travel path. Means for introducing the wafers to the path and for removing them therefrom are further included.