Patents by Inventor Jeffrey L. Galvin

Jeffrey L. Galvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser bonding tool with improved bonding accuracy
    Patent number: 7872208
    Abstract: A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: January 18, 2011
    Assignee: Medtronic, Inc.
    Inventors: David A. Ruben, Christopher T. Kinsey, Jeffrey L. Galvin, Scott B. Sleeper
  • Implantable medical device including a first enclosure portion having a feedthrough in a second interior surface
    Patent number: 5535097
    Abstract: An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: July 9, 1996
    Assignee: Medtronic, Inc.
    Inventors: David A. Ruben, Jeffrey L. Galvin, Bill R. Simmons, Lourdes O. Kline, Lynn M. Seifried, Craig L. Wiklund, John E. Nicholson, Thomas M. Nutzman
  • Reactive ion etch process for surface acoustic wave (SAW) device fabrication
    Patent number: 5106471
    Abstract: A dry etch process allows fabrication of very small SAW electrodes (less than 1 micron wide) on LiNbO.sub.3 (lithium niobate) or quartz substrates. In the process, analuminum (Al) layer is disposed on the substrate, and a photoresist layer is applied and exposed in the appropriate pattern. The wafer is then placed in an RIE where the Al is dry etched using a plasma containing chlorine and fluorine. The photoresist is then removed by an oxygen plasma. The oxygen also operates to replace the chlorine ions. By using this process, very precisely shaped electrodes can be formed.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: April 21, 1992
    Assignee: Motorola, Inc.
    Inventors: Jeffrey L. Galvin, Frederick J. Robinson, David M. Yee