Patents by Inventor Jeffrey L. Large

Jeffrey L. Large has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
    Patent number: 11967569
    Abstract: A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: April 23, 2024
    Assignee: Texas Instruments Incorporated
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS
    Publication number: 20220108960
    Abstract: A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Inventors: Michael Lee Dawson, Edward J. Pryor, Jeffrey L. Large, Mary Coles
  • Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
    Patent number: 11233017
    Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: January 25, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS
    Publication number: 20210104474
    Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 8, 2021
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • Low dielectric constant interconnect insulator having fullerene additive
    Publication number: 20040121501
    Abstract: An embodiment of the invention is semiconductor material, 2, having interconnect insulating material, 9, that contains fullerenes, 11. Another embodiment of the invention is a method of templating the voids in a semiconductor interconnect insulator, 9, by adding fullerenes, 11, to dielectric material, 10.
    Type: Application
    Filed: December 18, 2002
    Publication date: June 24, 2004
    Inventors: Jeffrey L. Large, Henry L. Edwards
  • System and method for chemical mechanical polishing
    Publication number: 20020049029
    Abstract: A chemical mechanical polishing machine includes a spindle operable to rotate with respect to a central axis. A wafer carrier may be coupled with the spindle, the wafer carrier operable to rotate in response to rotation of the spindle. A substrate may be coupled with the wafer carrier. In accordance with a particular embodiment of the present invention, a plurality of piezoelectric drive elements may be coupled with the wafer carrier.
    Type: Application
    Filed: October 11, 2001
    Publication date: April 25, 2002
    Inventors: Jeffrey L. Large, Barry Lanier
  • Laminar flow vacuum chuck
    Patent number: 5342068
    Abstract: A laminar flow vacuum chuck (10) has a plurality of vacuum ports (20, 52) disposed near the center of the chuck. A plurality of interconnected grooves (22, 24, 26, 26, 30, 32, 34, 36, 38, 40, 42, 44, 46, 50, 62, 64) extend from the vacuum ports (20, 52) to the perimeter 14. By reason of the shape of the interconnected grooves and the location of the vacuum ports, the downward force on a wafer supported by the chuck increases as the wafer size increases.
    Type: Grant
    Filed: August 26, 1993
    Date of Patent: August 30, 1994
    Assignee: Texas Instruments Incorporated
    Inventor: Jeffrey L. Large