Patents by Inventor Jeffrey L. O'Dell

Jeffrey L. O'Dell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated wafer defect inspection system and a process of performing such inspection
    Patent number: 9464992
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: October 11, 2016
    Assignee: Rudolph Technologies, Inc.
    Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Automated Wafer Defect Inspection System and a Process of Performing Such Inspection
    Publication number: 20160223470
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Application
    Filed: April 7, 2016
    Publication date: August 4, 2016
    Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Automated wafer defect inspection system and a process of performing such inspection
    Patent number: 9337071
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: May 10, 2016
    Assignee: Rudolph Technologies, Inc.
    Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins