Patents by Inventor Jeffrey Lan

Jeffrey Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of creating MEMS device cavities by a non-etching process
    Patent number: 8394656
    Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: March 12, 2013
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: Chun-Ming Wang, Jeffrey Lan, Teruo Sasagawa
  • Method of creating MEMS device cavities by a non-etching process
    Patent number: 7795061
    Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: September 14, 2010
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: Chun-Ming Wang, Jeffrey Lan, Teruo Sasagawa
  • Method of creating MEMS device cavities by a non-etching process
    Publication number: 20070155051
    Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Chun-Ming Wang, Jeffrey Lan, Teruo Sasagawa