Abstract: A door for mission critical enclosures, for example, cabinets containing sensitive items, such as electronics that may be exposed to high stress environments, for example shock and vibration. The door structure described provides improved mounting and lock features that can allow easy access while maintaining rigid structural needs and integrity. A door assembly for a cabinet generally includes a door that can be fitted directly, or indirectly, to an enclosure through an adapter frame. Generally, the door has fitting structures that operate as interlocking, tight fitting key sets. The fittings provide suitable detent features. An actuatable lock mechanism respectively locks and unlocks the door. The actuatable lock mechanism includes a ramped locking bolt that can engage a ramped surface of the cabinet or adapter frame to facilitate locking and unlocking of the door.

Abstract: A ruggedized display enclosure is described that houses an electronic display while withstanding severe shock and vibration, as well as environmental drip, such as for example conditions encountered in military environments. The ruggedized display enclosure has a cover structure to house the electronic display, but also allows the electronic display to be seen through the cover structure, so that the electronic display is usable when inside the enclosure. A damping material is arranged on outer areas of such an electronic display, between the electronic display and the cover structure. The damping material is arranged to allow the electronic display to be suspended with respect to the cover structure, thereby protecting the electronic display against conditions of shock and vibration.

Abstract: A door for mission critical enclosures, for example, cabinets containing sensitive items, such as electronics that may be exposed to high stress environments, for example shock and vibration. The door structure described provides improved mounting and lock features that can allow easy access while maintaining rigid structural needs and integrity. A door assembly for a cabinet generally includes a door that can be fitted directly, or indirectly, to an enclosure through an adapter frame. Generally, the door has fitting structures that operate as interlocking, tight fitting key sets. The fittings provide suitable detent features. An actuatable lock mechanism respectively locks and unlocks the door. The actuatable lock mechanism includes a ramped locking bolt that can engage a ramped surface of the cabinet or adapter frame to facilitate locking and unlocking of the door.

Abstract: A process for the formation of an article having multiple electrical circuits comprises: providing a first sub-element comprising in sequence a first metal layer of copper in electrical contact with a second metal layer of aluminum in electrical contact with a third metal layer of copper; etching an electrical circuit design in the first metal layer and in a separate etch step, etching away at least 10%, but less than 100% of the second metal layer to provide electrical connections between the first metal layer and the third metal layer; etching an electrical circuit design into the third metal layer; adhering an etched surface comprising the circuit design of the first or third metal layer to a first surface of a support layer to form a circuit board. The process may etch the first and third metal layers simultaneously or sequentially.

Abstract: A solder/desolder tool has a heater block supporting a handle at its upper end and a heating plate at its lower end. The heating plate is thermally engaged by heating elements housed in the heater block. An array of pin relief apertures are formed in the heating plate. Retractable clamps are pivoted to the heater block for clamping a leadless chip against the heating plate. The leadless chip has an array of input/output sockets corresponding to the array of pin relief apertures. A method is disclosed for soldering the chip sockets to a corresponding array of pins supported by a PC board. According to the method, solder balls are loaded in the chip sockets, and the chip is then secured in the tool to reflow the solder balls to form solder plugs. The solder plugs are then set upon the upper ends of the pins and melted by the heating plate so that solder joints are formed between the pins and sockets. The chip is released from the tool to allow the solder joints to cool.

Abstract: A solder/desolder tool has a heater block supporting a handle at its upper end and a heating plate at its lower end. The heating plate is thermally engaged by heating elements housed in the heater block. An array of pin relief apertures are formed in the heating plate. Retractable clamps are pivoted to the heater block for clamping a leadless chip against the heating plate. The leadless chip has an array of input/output sockets corresponding to the array of pin relief apertures. A method is disclosed for soldering the chip sockets to a corresponding array of pins supported by a PC board. According to the method, solder balls are loaded in the chip sockets, and the chip is then secured in the tool to reflow the solder balls to form solder plugs. The solder plugs are then set upon the upper ends of the pins and melted by the heating plate so that solder joints are formed between the pins and sockets. The chip is released from the tool to allow the solder joints to cool.