Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of manufacturing a product. In one aspect, the method comprises repeatedly performing the following: i) selecting a configuration of input settings for manufacturing a product, based on a causal model that measures causal relationships between input settings and a measure of a quality of the product; ii) determining the measure of the quality of the product manufactured using the configuration of input settings; and iii) adjusting, based on the measure of the quality of the product manufactured using the configuration of input settings, the causal model.

Abstract: A printed circuit board for high-power components includes at least two dielectric layers. A thermally-conductive embedded layer is disposed between two of the dielectric layers and includes one or more internal coolant channels. Thermal vias extend from the embedded layer to an exterior surface of at least one of the dielectric layers. At least one of the dielectric layers in the printed circuit board has an exterior surface on which one or more high power components may be mounted. In some implementations, there are at least two dielectric layers on a same side of the embedded layer and high power components may be located inside the printed circuit board between two dielectric layers. Thermal resistance between the high-power components and the embedded layer is decreased in comparison to typical surface-mounted cold plates, resulting in more efficient heat dissipation. In some implementations the embedded layer is also an electrical ground plane.