Abstract: A device for microscopically precise positioning and guidance of a measurement or manipulation element in at least two spatial axes, comprising an outer base with side walls defining a base interior, and an xy-stage having side walls and mounting means for at least one measurement or manipulation element, the xy-stage being arranged inside of the base interior and being displaceable in an XY-plane relative to the outer base. The xy-stage is coupled to the outer base with bending elements, and with actuators designed for displacing the xy-stage relative to the outer base. The outer base is provided with at least one stiffening element rigidly connected to the side walls of the outer base, and/or that the xy-stage is provided with at least one stiffening element rigidly connected to the side walls of the xy-stage.

Abstract: A device for microscopically precise positioning and guidance of a measurement or manipulation element in at least two spatial axes, comprising an outer base with side walls defining a base interior, and an xy-stage having side walls and mounting means for at least one measurement or manipulation element, the xy-stage being arranged inside of the base interior and being displaceable in an XY-plane relative to the outer base. The xy-stage is coupled to the outer base with bending elements, and with actuators designed for displacing the xy-stage relative to the outer base. The outer base is provided with at least one stiffening element rigidly connected to the side walls of the outer base, and/or that the xy-stage is provided with at least one stiffening element rigidly connected to the side walls of the xy-stage.

Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.

Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.

Abstract: A method and apparatus are provided that have the capability of rapidly scanning a large sample of arbitrary characteristics under force control feedback so has to obtain a high resolution image. The method includes generating relative scanning movement between a probe of the SPM and a sample to scan the probe through a scan range of at least 4 microns at a rate of at least 30 lines/sec and controlling probe-sample interaction with a force control slew rate of at least 1 mm/sec. A preferred SPM capable of achieving these results has a force controller having a force control bandwidth of at least closed loop bandwidth of at least 10 kHz.

Abstract: A method and apparatus are provided that have the capability of rapidly scanning a large sample of arbitrary characteristics under force control feedback so has to obtain a high resolution image. The method includes generating relative scanning movement between a probe of the SPM and a sample to scan the probe through a scan range of at least 4 microns at a rate of at least 30 lines/sec and controlling probe-sample interaction with a force control slew rate of at least 1 mm/sec. A preferred SPM capable of achieving these results has a force controller having a force control bandwidth of at least closed loop bandwidth of at least 10 kHz.