Abstract: An electrical device carrier contact assembly for installation on a circuit board is disclosed. The contact assembly includes a first electrical contact having a first mounting portion and a first receptacle contact portion; a second electrical contact having a second mounting portion and a second receptacle contact portion; and an electrical device secured to the first mounting portion and to the second mounting portion. The electrical device carrier contact assembly is configured to be manipulated and installed on the circuit board as a single unit. A PCB assembly includes a PCB and the electrical device carrier contact assembly inserted by an insertion tool.

Abstract: An electrical connector for mating with a complementary connector receptacle is provided and includes a housing configured and adapted for selective matable connection with a corresponding complementary connector receptacle; a pair of latch arms provided on opposite sides of the housing; and a pair of latch guards extending from the sides of the housing and overlying at least a portion of a respective latch arm. Each latch arm includes a hinge joint spaced a selected distance rearwardly from a forward end thereof for joining the latch arm to a respective side of the housing. Accordingly, as a latch arm is twisted about the hinge joint, at least a portion of the latch arm abuts against the respective latch guard and additional twisting of the latch arm about the hinge joint is prevented.

Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. Pins are securely located on the substrate, which are used to align the interconnect with the electrical component for connection.

Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.