Abstract: Control logic in a memory device executes a programming operation to program the set of memory blocks of the set of memory planes to a set of a programming levels. In response to determining at least a portion of a first memory block passed a program verify operation associated with a last programming level of the set of programming levels, the control logic executes a first program sub-operation to terminate the programming operation with respect to a first subset of one or more memory planes of the set of memory planes that passed the program verify operation associated with the last programming level and identify a second subset of one or more memory planes that failed the program verify operation associated with the last programming level. The control logic executes a second program sub-operation to apply a trim set to the second subset of one or more memory planes that failed the program verify operation of the last programming level.

Abstract: A memory device comprising a memory array and control logic operatively coupled with the memory array. The control logic is to: detect a program operation directed at a selected wordline of multiple wordlines of the memory array; determine, during an initial phase of the program operation, whether a program voltage being applied to the selected wordline satisfies a threshold program voltage; add, in response to the program voltage not satisfying the threshold program voltage, a base offset voltage to an initial pass voltage to generate a higher pass voltage, the initial pass voltage being a percentage of an initial program voltage; and cause the higher pass voltage to be applied to a remainder of the multiple wordlines other than the selected wordline.

Abstract: Control logic in a memory device initiates a first loop of a program operation, the first loop comprising (a) a program phase where a plurality of memory cells associated with a selected wordline in a block of the memory array are programmed to respective ones of a plurality of programming levels and (b) a corresponding program verify phase. The control logic further identifies memory cells of the plurality of memory cells associated with a first sub-set of the plurality of programming levels to be verified during the program verify phase, the first sub-set comprising two or more dynamically selected programming levels comprising at least a lowest programming level and a second lowest programing level of the respective ones of the plurality of programming levels.

Abstract: A device includes a memory array and a sense circuit coupled with the memory array. The sense circuit includes a sense node coupled with a data line of the memory array. A first sensing path includes a first transistor having a first gate coupled with the sense node. A second sensing path includes a second transistor having a second gate coupled with the sense node. A first threshold voltage of the first transistors differs from a second threshold voltage of the second transistor by a threshold voltage gap.

Abstract: A device includes a memory array and a sense circuit coupled with the memory array. The sense circuit includes a sense node coupled with a data line of the memory array. A first sensing path includes a first transistor having a first gate coupled with the sense node. A second sensing path includes a second transistor having a second gate coupled with the sense node. A first threshold voltage of the first transistors differs from a second threshold voltage of the second transistor by a threshold voltage gap.

Abstract: Some embodiments include a device having storage node and a latch circuit coupled to the storage node to latch data provided to the storage node during one of a first mode and a second mode of the device. The latch circuit includes a first transistor, a second transistor, and a third transistor coupled between a first voltage node and a second voltage node. The third transistor is configured to selectively turn on and off in the first and second modes. Other embodiments are described.

Abstract: Some embodiments include a device having storage node and a latch circuit coupled to the storage node to latch data provided to the storage node during one of a first mode and a second mode of the device. The latch circuit includes a first transistor, a second transistor, and a third transistor coupled between a first voltage node and a second voltage node. The third transistor is configured to selectively turn on and off in the first and second modes. Other embodiments are described.

Abstract: A programming circuit and method to apply a controlled or predetermined voltage pulse for charge transfer to or from the floating gate of a non-volatile memory cell in an incremental manner to control the overall voltage across the gate oxide. Voltage above a transfer threshold voltage, such as above a tunneling threshold voltage, is applied in a stepwise charge transfer manner to or from the floating gate up to a voltage limit that is below the thin oxide damage threshold. Controlling the overall voltage avoids oxide breakdown and enhances reliability.

Abstract: A programming circuit and method to apply a controlled or predetermined voltage pulse for charge transfer to or from the floating gate of a non-volatile memory cell in an incremental manner to control the overall voltage across the gate oxide. Voltage above a transfer threshold voltage, such as above a tunneling threshold voltage, is applied in a stepwise charge transfer manner to or from the floating gate up to a voltage limit that is below the thin oxide damage threshold. Controlling the overall voltage avoids oxide breakdown and enhances reliability.

Abstract: An improved CMOS high-voltage latch that stores data bits to be written to memory cells of a non-volatile memory is connected to a Vdd supply voltage during a standby mode of operation and during a load-data mode of operation. During a high-voltage write mode of operation, the HV terminal is connected to a HIGH-VOLTAGE supply voltage. A cross-coupled high-voltage CMOS latch is connected between the HV terminal and a ground terminal and has a latch input node B and a latch output node A. An input buffer is connected between the HV terminal and the ground terminal and has an input terminal connected to a DATA INPUT terminal. An output terminal of the input buffer is connected to the latch input node B. The input buffer is enabled during a load-data mode of operation to load data from a DATA INPUT terminal to the latch input node B of the cross-coupled high-voltage CMOS latch.

Abstract: An improved CMOS high-voltage latch that stores data bits to be written to memory cells of a non-volatile memory is connected to a Vdd supply voltage during a standby mode of operation and during a load-data mode of operation. During a high-voltage write mode of operation, the HV terminal is connected to a HIGH-VOLTAGE supply voltage. A cross-coupled high-voltage CMOS latch is connected between the HV terminal and a ground terminal and has a latch input node B and a latch output node A. An input buffer is connected between the HV terminal and the ground terminal and has an input terminal connected to a DATA INPUT terminal. An output terminal of the input buffer is connected to the latch input node B. The input buffer is enabled during a load-data mode of operation to load data from a DATA INPUT terminal to the latch input node B of the cross-coupled high-voltage CMOS latch.

Abstract: An improved CMOS high-voltage latch stores data bits to be written to memory cells of a non-volatile memory has two cross-coupled CMOS inverters. One of the inverters has a pull-down leg that includes a pass-gate high-voltage NMOS transistor that is connected between a latch output node and a second high-voltage, low-threshold NMOS pull-down transistor that is connected to ground. A gate of the pass-gate high-voltage NMOS transistor receives a standby signal with a logic HIGH value of at most Vdd to turn on the pass-gate high-voltage NMOS transistor when the high-voltage CMOS latch is in a voltage mode of operation and during a high-voltage write mode of operation. The pass-gate high-voltage NMOS transistor thereby limits the voltage across the second high-voltage, low-threshold NMOS pull-down transistor to less than the standby signal in order to reduce punch-trough current and drain-to-substrate leakage of the second high-voltage, low-threshold NMOS pull-down transistor.

Abstract: A power down reset circuit for asserting a signal when a first VDD voltage falls below a voltage threshold. The circuit has at least one diode coupled to the first VDD voltage. The at least one diode is configured to produce a second voltage. At least one capacitor is coupled to the at least one diode to maintain the second voltage. A voltage detector asserts a signal when the first VDD voltage drops below a threshold level. The voltage detector is powered by the second voltage and is coupled to the at least one diode.

Abstract: A flash memory programming process incorporates two charge pumps per byte of bit cells. Placing a data “one” value in each bit cell erases an entire memory device. Before programming each cell, a prospective data content is scrutinized. If a data “zero” is to be applied to the bit cell, a charge pump engages to bias the cell and activate a hot electron injection process to affect the programming. If a data “one” is to be applied to the bit cell, no programming activity is undertaken and the process increments to the next bit cell in the data structure. Therefore, total programming time is reduced proportionally to the number of data “one” bits to be programmed. Where more than one charge pump is engaged in parallel to a data structure, total programming time is further reduced when two data “one” values are to be programmed in parallel.