Patents by Inventor Jeffrey Munro

Jeffrey Munro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210062018
    Abstract: A composition comprising the following: A) coated polymer particles, and wherein the polymer particles are formed from a first composition comprising an ethylene-based polymer that comprises the following properties: a density from 0.854 to 0.860 g/cc, and a melt index (I2) from 4.0 to 15.0 g/10 min; and wherein the polymer particles comprise a coating on at least a portion of the total surface of the polymer particles, and wherein the coating is formed from a powder composition comprising at least one inorganic powder, and at least one organic powder selected from a metal stearate and/or a polymer powder, and wherein the weight ratio of the total amount of the inorganic powder to the total amount of the organic powder is from 3.0 to 50.0; B) optionally, a propylene-based polymer.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 4, 2021
    Inventors: Jeffrey Munro, Jihean Lee, Morgan M. Hughes
  • Publication number: 20080057740
    Abstract: Methods are disclosed for activating dopants in a doped semiconductor substrate. A carbon precursor is flowed into a substrate processing chamber within which the doped semiconductor substrate is disposed. A plasma is formed from the carbon precursor in the substrate processing chamber. A carbon film is deposited over the substrate with the plasma. A temperature of the substrate is maintained while depositing the carbon film less than 500° C. The deposited carbon film is exposed to electromagnetic radiation for a period less than 10 ms, and has an extinction coefficient greater than 0.3 at a wavelength comprised by the electromagnetic radiation.
    Type: Application
    Filed: August 24, 2007
    Publication date: March 6, 2008
    Applicant: Applied Materials, Inc.
    Inventors: Jeffrey Munro, Srinivas Nemani, Young Lee, Marlon Menezes, Christopher Bencher, Vijay Parihar
  • Publication number: 20080026597
    Abstract: Methods of making a silicon oxide layer on a substrate are described. The methods may include forming the silicon oxide layer on the substrate in a reaction chamber by reacting an atomic oxygen precursor and a silicon precursor and depositing reaction products on the substrate. The atomic oxygen precursor is generated outside the reaction chamber. The methods also include heating the silicon oxide layer at a temperature of about 600° C. or less, and exposing the silicon oxide layer to an induced coupled plasma. Additional methods are described where the deposited silicon oxide layer is cured by exposing the layer to ultra-violet light, and also exposing the layer to an induced coupled plasma.
    Type: Application
    Filed: May 25, 2007
    Publication date: January 31, 2008
    Applicant: Applied Materials, Inc.
    Inventors: Jeffrey Munro, Srinivas Nemani
  • Publication number: 20070054504
    Abstract: A plasma treatment process for increasing the tensile stress of a silicon wafer is described. Following deposition of a dielectric layer on a substrate, the substrate is lifted to an elevated position above the substrate receiving surface and exposed to a plasma treatment process which treats both the top and bottom surface of the wafer and increases the tensile stress of the deposited layer. Another embodiment of the invention involves biasing of the substrate prior to plasma treatment to bombard the wafer with plasma ions and raise the temperature of the substrate. In another embodiment of the invention, a two-step plasma treatment process can be used where the substrate is first exposed to a plasma at a processing position directly after deposition, and then raised to an elevated position where both the top and bottom of the wafer are exposed to the plasma.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 8, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Xiaolin Chen, Srinivas Nemani, DongQing Li, Jeffrey Munro, Marlon Menezes