Abstract: A method of treating the surface of a semiconductor wafer through the formation of a bonding system is provided in order to enhance the handling of the wafer during subsequent processing operations. The method generally comprises the steps of applying a release layer and an adhesive to different wafers; bonding the wafers together to form a bonded wafer system; performing at least one wafer processing operation (e.g., wafer grinding, etc.) to form a thin processed wafer; debonding the wafers; and then cleaning the surface of the processed wafer with an organic solvent that is capable of dissolving the release layer or any residue thereof. The adhesive includes a vinyl-functionalized polysiloxane oligomeric resin, a Si—H functional polysiloxane oligomeric resin, a catalyst, and optionally an inhibitor, while the release layer is comprised of either a silsesquioxane-based resin or a thermoplastic resin.

Abstract: A method of treating the surface of a semiconductor wafer through the formation of a bonding system is provided in order to enhance the handling of the wafer during subsequent processing operations. The method generally comprises the steps of applying a release layer and an adhesive to different wafers; bonding the wafers together to form a bonded wafer system; performing at least one wafer processing operation (e.g., wafer grinding, etc.) to form a thin processed wafer; debonding the wafers; and then cleaning the surface of the processed wafer with an organic solvent that is capable of dissolving the release layer or any residue thereof. The adhesive includes a vinyl-functionalized polysiloxane oligomeric resin, a Si—H functional polysiloxane oligomeric resin, a catalyst, and optionally an inhibitor, while the release layer is comprised of either a silsesquioxane-based resin or a thermoplastic resin.

Abstract: Methods and apparatus are provided for making multilayer plastic articles. Initially, two or more streams of diverse thermoplastic materials are provided. Layers are formed from these streams and are arranged in a layered first composite stream. The first composite stream may be directly formed into a desired configuration by a molding process or may be manipulated to form a second composite stream having an increased number of layers before being formed into the desired configuration. The resulting articles are comprised of a number of discrete and substantially continuous layers.

Abstract: Methods and apparatus are provided for making multilayer plastic articles. Initially, two or more streams diverse thermoplastic materials are provided. Layers are foraged from these streams and are arranged in a layered first composite stream. The first composite stream may be directly formed into a desired configuration by a molding process or may be manipulated to form a second composite stream having an increased number of layers before being formed into the desired configuration. The resulting articles are comprised of a number of discrete and substantially continuous layers.