Abstract: An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A shortened ground path for the shield of a shielded modular connector (e.g., RJ-45, etc.) mounted against a bracket that is to be seated against a slot in a chassis is provided by a metallic grounding clip that slips over the bracket. The clip has edges that have been folded to slidably engage the bracket, and an orifice shaped to match the opening of the modular jack, so that the modular plug may pass through that orifice as it mates with the jack. The clip also has two opposing curved metal contacts along the perimeter of the orifice that engage and bear against the exposed shield portion of the modular plug as it mates with the modular jack. A pair of metal tabs engage the opening of the modular jack to align, or register, the orifice in the clip with the opening of the jack, and prevent the clip from easily sliding along the bracket once registration has been achieved.