Patents by Inventor Jeffrey Niew

Jeffrey Niew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package with a CMOS die positioned underneath a MEMS die
    Patent number: 8791531
    Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: July 29, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, David Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert
  • Package With A CMOS Die Positioned Underneath A MEMS Die
    Publication number: 20120161259
    Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
    Type: Application
    Filed: October 21, 2011
    Publication date: June 28, 2012
    Inventors: Peter V. Loeppert, Daniel Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert