Patents by Inventor Jeffrey O'Dell

Jeffrey O'Dell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120087569
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Application
    Filed: October 14, 2011
    Publication date: April 12, 2012
    Applicant: RUDOLPH TECHNOLOGIES, INC.
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Publication number: 20100239157
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Application
    Filed: May 28, 2010
    Publication date: September 23, 2010
    Applicant: RUDOLPH TECHNOLOGIES, INC.
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Patent number: 7729528
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: June 1, 2010
    Assignee: Rudolph Technologies, Inc.
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Patent number: 6937753
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: April 29, 2000
    Date of Patent: August 30, 2005
    Assignee: August Technology Corp.
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Steve Herrmann
  • Publication number: 20050008218
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Application
    Filed: August 10, 2004
    Publication date: January 13, 2005
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Patent number: 6826298
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: April 29, 2000
    Date of Patent: November 30, 2004
    Assignee: August Technology Corp.
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Patent number: 6324298
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: November 27, 2001
    Assignee: August Technology Corp.
    Inventors: Jeffrey O'Dell, Mark Harless, Thomas Verburgt