Abstract: A method of preparing a compound of formula I wherein R is a hydrocarbon and n is an integer from 1 to 5, including the steps of: contacting a compound of formula II with a compound selected from the group consisting of amines, and carbonates, bicarbonates, and hydroxides of alkali metals, and combinations thereof, in a solvent to produce a salt of a compound of formula II; treating the salt of the compound of formula II in a polar, aprotic solvent with an organic halide having a formula R—X, wherein X is selected from chlorine, bromine, iodine, and combinations thereof, to produce an ester of formula I; isolating a reaction product including the ester of formula I from the solvent by precipitation or solvent extraction; and purifying the compound of formula I, is disclosed.

Abstract: Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.

Abstract: A curing agent for epoxy resins having improved solubility characteristics has the formula ##STR1## where R is --CH.sub.2 C.sub.6 H.sub.4 X or --CH.sub.2 CH.sub.2 C.sub.6 H.sub.4 X,and X is either --H, --CH.sub.3, --OCH.sub.3, --OH, or --NY,and where Y is --H or CH.sub.3.Such substituted cyanoguanidines are soluble in various solvents and do not require the use of undesirable solvents necessary with cyanoguanidine (dicyanodiamide) itself.

Abstract: This invention relates to an improved, high-yield process for producing cyclic siloxane in a biphasic reaction solvent mixture comprising an alkane, an alcohol and water.

Abstract: Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.

Abstract: A method is presented to prepare totally functionalized ether-capped oligomeric polyphenols without molecular weight fractionation. The products generally are very low in inorganic salts and are characterized by the absence of volatiles leading to void formation in their subsequent curing. The success of the method rests upon conducting the reaction under totally homogeneous conditions throughout.

Abstract: The resins resulting from converting dicyclopentadiene-phenol adducts to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from therma, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.

Abstract: The resins resulting from converting the phenol-formaldehyde type condensation products of dicyclopentadiene-phenol adducts with selected aldehydes and ketones to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from thermal, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.