Abstract: Laser cores are provided having a header having a base with a stem extending therefrom; a terminal extending from a sealed opening in the base proximate to but separate from the stem; a conductive surface electrically connected to the laser and positioned between the stem and the terminal; and a conductive mass between the terminal and the conductive surface having a cross-sectional area that is based upon a size of an overlap area between the terminal and the conductive surface.

Abstract: Laser cores are provided having a header having a base with a stem extending therefrom; a terminal extending from a sealed opening in the base proximate to but separate from the stem; a conductive surface electrically connected to the laser and positioned between the stem and the terminal; and a conductive mass between the terminal and the conductive surface having a cross-sectional area that is based upon a size of an overlap area between the terminal and the conductive surface.

Abstract: Laser modules are provided having electrical connections that are resistant to damage caused by transient or higher order accelerations.

Abstract: Laser modules are provided having electrical connections that are resistant to damage caused by transient or higher order accelerations.

Abstract: Methods for making laser cores are provided. In one method, a header is provided with a base having a stem extending therefrom and an electrically conductive terminal extending through a sealed opening in the base, a conductive surface that is electrically connected a laser is positioned between the terminal and the stem to create a sized overlap area between the terminal and the conductive surface; and a conductive mass is formed between the terminal and to the conductive surface having a cross-sectional area that is based upon the size of the overlap area.

Abstract: Laser modules are provided having electrical connections that are resistant to damage caused by transient or higher order accelerations.

Abstract: A fluid flow path, a microfluidic device including the fluid flow path, and methods of forming the same are described. The fluid flow path can include an inlet and at least one outlet, and is defined by a first substrate and a second substrate, each having one or more fluid via extending therethrough, and an adhesive sealant between the first substrate and the second substrate, wherein the adhesive sealant surrounds at least one via of each substrate such that fluid flows through the vias and an area bounded by the adhesive sealant between the substrates. The adhesive sealant can be a bismaleimide-containing compound.

Abstract: A printhead includes a printhead die and an interconnect substrate. The printhead die includes a surface. The interconnect substrate includes electrical circuitry and a surface. The electrical circuitry is in electrical communication with the printhead die through a plurality of electrical connections. An encapsulant structure is positioned to encapsulate the plurality of electrical connections, and includes a barrier portion and a filler portion. The barrier portion includes a first wall and a second wall. The first wall is in contact with the surface of the printhead die and the second wall is in contact with the surface of the interconnect substrate. The filler portion is in contact with the plurality of electrical connections and positioned between the first wall of the barrier portion and the second wall of the barrier portion.

Abstract: A method of bonding a cover plate over OLED devices formed on a surface of a device substrate wherein each one of the OLED devices includes at least one electrical interconnect area includes providing a flow-preventing pattern on a surface of the cover plate or on the OLED devices absent from the electrical interconnect areas of the OLED devices to prevent flow of a flowable adhesive material into at least the outermost portions of such interconnect areas; dispensing a selected amount of a flowable curable adhesive material on the surface of the cover plate in registration with the flow-preventing pattern; engaging the cover plate in alignment with the substrate; and curing the adhesive material.

Abstract: A method of bonding a common cover plate over a plurality of OLED devices formed on a device substrate includes providing an unpatterned or a patterned layer of a pressure-sensitive adhesive (PSA) material over a surface of the cover plate; bonding the cover plate over the OLED devices; and singulating individual OLED devices having a bonded cover plate and permitting electrical access to electrical interconnects associated with each OLED device for attaching electrical leads thereto.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Abstract: An integrated touch screen and OLED flat-panel display includes a touch screen having a touch screen substrate with electrical contacts for receiving touch screen signals and conductive vias through the substrate and electrically connected to the electrical contacts; an OLED flat-panel display having a display substrate with electrical contacts for receiving display signals and an exposed area on the display substrate for providing electrical connection to the electrical contacts of the display and the touch screen; and wherein the touch screen substrate is the cover or substrate of the OLED flat-panel display, the conductive vias are electrically connected to conductors and electrical contacts located on the display substrate, and the substrate of the OLED flat-panel display protrudes beyond the cover to provide electrical connection to the electrical contacts of the display and touch screen.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Abstract: An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium minimum humidity level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.

Abstract: A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.