Abstract: A method for making a thermoplastic, thermally-conductive interface article is provided. The method used to make the interface article involves injection-molding a moldable composition into molding members. The moldable composition contains a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The thermally-conductive articles can be used as thermal interfaces to dissipate heat from heat-generating electronic devices.

Abstract: A three-dimensional cold plate assembly and method of manufacturing the same is disclosed. The cold plate assembly includes a metallic substrate having a top side and a bottom side and a three-dimensional molded contoured plastic body having a top side and a bottom side. The bottom side of the metallic substrate is bonded to the top side of the plastic body. The bottom side of the plastic body is contoured to substantially complementarily mate with a profile of heat generating components in an electronic device. The method of manufacturing the cold plate includes the steps of pretreating and cleaning the metallic substrate, etching the metallic substrate and overmolding the plastic body onto the bottom side of the metallic substrate to provide a bottom contoured side of the plastic body that substantially complementarily mates with the profile of heat generating components in an electronic device.

Abstract: A three-dimensional cold plate assembly and method of manufacturing the same is disclosed. The cold plate assembly includes a metallic substrate having a top side and a bottom side and a three-dimensional molded contoured plastic body having a top side and a bottom side. The bottom side of the metallic substrate is bonded to the top side of the plastic body. The bottom side of the plastic body is contoured to substantially complementarily mate with a profile of heat generating components in an electronic device. The method of manufacturing the cold plate includes the steps of pretreating and cleaning the metallic substrate, etching the metallic substrate and overmolding the plastic body onto the bottom side of the metallic substrate to provide a bottom contoured side of the plastic body that substantially complementarily mates with the profile of heat generating components in an electronic device.

Abstract: An apparatus for measuring the concentration of formaldehyde in an exhaust stream from turbines, internal combustion engines and the like, which apparatus includes a portable housing having a sample gas inlet through which a sample gas for analysis is introduced into the portable housing and an analysis system disposed in the portable housing suitable for analyzing the sample gas for the presence of formaldehyde in the sample gas.

Abstract: A method for making a thermoplastic, thermally-conductive interface article is provided. The method used to make the interface article involves injection-molding a moldable composition into molding members. The moldable composition contains a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The thermally-conductive articles can be used as thermal interfaces to dissipate heat from heat-generating electronic devices.

Abstract: The present invention discloses a thermal transfer interface having an integrally formed means for fastening and maintaining intimate thermal contact between a heat generating device and a heat-dissipating device. The interface of the present invention includes two components, a compressible thermal transfer component having a first thickness and an adhesive fastening component having a second thickness that is less than the first. The first component, the thermal transfer element, includes a base polymer matrix compound that is loaded with a thermally conducting filler that imparts thermally conductive properties to the net shape moldable material. The polymer base matrix is preferably a highly compressible material such as an elastomer. The second component of the present invention is a pressure sensitive adhesive component. The adhesive is applied adjacent to the thermal transfer element or in an alternating pattern throughout a base field of thermal transfer material.

Abstract: A thermoplastic, thermally-conductive interface article is provided. The interface article is elastomeric and can be used to provide a thermally-conductive pathway between a heat-generating product such as an electronic device and a heat-sink. The interface article also can have good electrical-conductivity. The elastomeric interface article is made from a composition comprising a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material.

Abstract: The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties. In addition, the present invention provides a method of manufacturing an elastomeric heat sink device as described above.

Abstract: The present invention discloses method of manufacturing a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties.

Abstract: The present invention relates to a method of manufacturing a thermally conductive article having an integrated thermally conductive surface. The method involves molding a first thermally conductive composition to form a body of the article and then molding a second thermally conductive composition to form an integrated surface on the body of the article. The integrated thermally conductive surface can interface with a heat-generating device (e.g., an electronic part) to dissipate heat from the device. The invention also encompasses thermally conductive articles produced by this method.

Abstract: An apparatus for measuring the concentration of formaldehyde in an exhaust stream from turbines, internal combustion engines and the like, which apparatus includes a portable housing having a sample gas inlet through which a sample gas for analysis is introduced into the portable housing and an analysis system disposed in the portable housing suitable for analyzing the sample gas for the presence of formaldehyde in the sample gas.

Abstract: A thermoplastic, thermally-conductive composition is provided. The composition comprises a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The composition can be used to make shaped, thermally-conductive articles. The articles can be used as thermal interfaces for dissipating heat from heat-generating devices such as electronic parts. The articles can have good electrical conductivity.

Abstract: The present invention discloses a thermal transfer interface having an integrally formed means for fastening and maintaining intimate thermal contact between a heat generating device and a heat-dissipating device. The interface of the present invention includes two components, a compressible thermal transfer component having a first thickness and an adhesive fastening component having a second thickness that is less than the first. The first component, the thermal transfer element, includes a base polymer matrix compound that is loaded with a thermally conducting filler that imparts thermally conductive properties to the net shape moldable material. The polymer base matrix is preferably a highly compressible material such as an elastomer. The second component of the present invention is a pressure sensitive adhesive component. The adhesive is applied adjacent to the thermal transfer element or in an alternating pattern throughout a base field of thermal transfer material.

Abstract: The present invention relates to a method of manufacturing a thermally conductive article having an integrated thermally conductive surface. The method involves molding a first thermally conductive composition to form a body of the article and then molding a second thermally conductive composition to form an integrated surface on the body of the article. The integrated thermally conductive surface can interface with a heat-generating device (e.g., an electronic part) to dissipate heat from the device. The invention also encompasses thermally conductive articles produced by this method.