Patents by Inventor Jeffrey Putney

Jeffrey Putney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8541946
    Abstract: Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: September 24, 2013
    Assignee: The Board of Trustees of the University of illinois
    Inventors: J. Gary Eden, Sung-Jin Park, Jason D. Readle, Jekwon Yoon, Andrew Price, Jeffrey Putney
  • Publication number: 20110148282
    Abstract: Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
    Type: Application
    Filed: December 17, 2009
    Publication date: June 23, 2011
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: J. Gary Eden, Sung-Jin Park, Jason D. Readle, Jekwon Yoon, Andrew Price, Jeffrey Putney