Patents by Inventor Jeffrey R. Ogorzalek

Jeffrey R. Ogorzalek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
    Publication number: 20210197325
    Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
    Type: Application
    Filed: March 12, 2021
    Publication date: July 1, 2021
    Inventors: Sergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott
  • Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
    Patent number: 11033990
    Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 15, 2021
    Assignee: RAYTHEON COMPANY
    Inventors: Sergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott
  • LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
    Publication number: 20200171609
    Abstract: A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 4, 2020
    Inventors: Sergio V. Martinez, Jeffrey R. Ogorzalek, Patrick J. Lott