Abstract: A combination heat sink and air director apparatus includes a plurality of conduction plates. Each conduction plate is positioned to extend into a gap between adjacent memory cards of a plurality of memory cards previously installed in memory card slots of a motherboard of a computing device. The apparatus includes a heat sink thermally coupled to the conduction plates and mounted above the conduction plates. An air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components of the computing device adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow.

Abstract: A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module (“DIMM”) installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

Abstract: Cooling systems having cooling and augmentation loops for electronic components and related methods are disclosed. According to an aspect, a cooling system for an electronic component includes a cooling loop in thermal transfer interface with a first electronic component. The cooling loop is configured to contain a first flow of a cooling liquid between an inlet and an outlet. The cooling system also includes at least one augmentation loop configured to contain a second flow of the cooling liquid and alternately engage and disengage with respect to the cooling loop, such that engaging the augmentation loop to the cooling loop converts a series flow pattern with the first flow of the cooling liquid into a parallel flow pattern of a portion of the first flow of the cooling liquid with the second flow of the cooling liquid, without disconnection of the cooling loop from the inlet and outlet.

Abstract: Targeted cooling in a liquid cooling system including detecting, for a node cooled by the liquid cooling system, a condition indicating increased heating, wherein the liquid cooling system includes a primary pump and a node-specific pump positioned in a loop of the liquid cooling system between the primary pump and the node; and responsive to detection of the condition, increasing cooling to the node by increasing liquid flow rate at the node-specific pump positioned in the loop of the liquid cooling system between the primary pump and the node, thereby achieving a higher temperature differential between an inlet and an outlet line and increased waste heat recovery.

Abstract: A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module (“DIMM”) installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

Abstract: An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

Abstract: Detecting coolant leaks in a server system including receiving, by a controller in the server system with nodes stacked vertically, a voltage fault alert from a first node; receiving, by the controller in the server system with nodes stacked vertically, a voltage fault alert from a second node located below the first node; and upon receiving the voltage fault alert from the first node and the voltage fault alert from the second node, powering down, by the controller, one or more nodes located below the second node.

Abstract: An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

Abstract: Automatically cooling computer system components for safe servicing includes: determining that a target component of a plurality of components is to be serviced; and reducing temperature of one or more components of said plurality of components if such one or more components exceeds a threshold temperature and such one or more components are within a predefined area of the target component.

Abstract: An apparatus, method, and program product are disclosed for loading a program during boot of a device. A monitor module collects usage data for each of one or more programs executing on a device. The usage data for each program comprising an amount of time that the program was used and a schedule of when the program was used. A priority module assigns a boot priority to each of the one or more programs based on the amount of time that each program was used. A boot module selects one or more programs to load during a boot period for the device based on each program's usage schedule. The one or more selected programs are loaded according to each selected program's boot priority.

Abstract: Automatically cooling computer system components for safe servicing includes: determining that a target component of a plurality of components is to be serviced; and reducing temperature of one or more components of said plurality of components if such one or more components exceeds a threshold temperature and such one or more components are within a predefined area of the target component.

Abstract: Automatically cooling computer system components for safe servicing includes: determining that a target component of a plurality of components is to be serviced; and reducing temperature of one or more components of said plurality of components if such one or more components exceeds a threshold temperature and such one or more components are within a predefined area of the target component.

Abstract: An apparatus for workload management includes a thermal relationship module, a thermal effect module, and a resource allocation module. The thermal relationship module determines a plurality of thermal relationships among components of an electronic device. Each thermal relationship quantifies a thermal impact on one of the components of utilizing another of the components. The thermal effect module determines one or more potential thermal effects of a workload on the components based on the thermal relationships. The one or more potential thermal effects correspond to one or more possible allocations of resources of at least a portion of the components to run the workload. The resource allocation module selects an allocation of resources from the one or more possible allocations of resources to run the workload, based on the determined potential thermal effects.

Abstract: A method of a first mobile computing device includes storing a wireless communication address of a second mobile computing device, determining that the first mobile computing device has left a sleep state while in a closed condition, and automatically wirelessly transmitting a notification to the second mobile computing device in response to determining that the first mobile computing device has left the sleep state while in a closed condition. A method of a second mobile computing device includes receiving a wireless notification from a first mobile computing device indicating that the first mobile computing device has left a sleep state while in a closed condition, and providing an alert to a user of the second mobile computing device in response to receiving the wireless notification.

Abstract: Processing visual cues to improve understanding of an input is described herein, including receiving a visual cue, the visual cue including visual media of a target; storing a list of words representing the target; and updating a probable words dictionary to include the list of words.

Abstract: A method includes a compute node transmitting data to a port of a first switch at a first data transfer rate, monitoring the temperature of the port, and a management node providing an instruction to the compute node in response to the port temperature exceeding a temperature limit, wherein the instruction instructs the compute node to reduce the first data transfer rate to the port. The method further includes the compute node reducing the data transfer rate to the port in response to receiving the instruction. The method is applicable to multiple compute nodes transmitting data to multiple ports of a first switch. The data transfer rate may be reduced by throttling the compute node, renegotiating a link speed between the compute node and the port, or redirecting data to another switch. The methods facilitate thermal control of a switch without its own thermal throttling capability.

Abstract: An apparatus, method, and program product are disclosed for loading a program during boot of a device. A monitor module collects usage data for each of one or more programs executing on a device. The usage data for each program comprising an amount of time that the program was used and a schedule of when the program was used. A priority module assigns a boot priority to each of the one or more programs based on the amount of time that each program was used. A boot module selects one or more programs to load during a boot period for the device based on each program's usage schedule. The one or more selected programs are loaded according to each selected program's boot priority.

Abstract: A method of a first mobile computing device includes storing a wireless communication address of a second mobile computing device, determining that the first mobile computing device has left a sleep state while in a closed condition, and automatically wirelessly transmitting a notification to the second mobile computing device in response to determining that the first mobile computing device has left the sleep state while in a closed condition. A method of a second mobile computing device includes receiving a wireless notification from a first mobile computing device indicating that the first mobile computing device has left a sleep state while in a closed condition, and providing an alert to a user of the second mobile computing device in response to receiving the wireless notification.

Abstract: A method includes a compute node transmitting data to a port of a first switch at a first data transfer rate, monitoring the temperature of the port, and a management node providing an instruction to the compute node in response to the port temperature exceeding a temperature limit, wherein the instruction instructs the compute node to reduce the first data transfer rate to the port. The method further includes the compute node reducing the data transfer rate to the port in response to receiving the instruction. The method is applicable to multiple compute nodes transmitting data to multiple ports of a first switch. The data transfer rate may be reduced by throttling the compute node, renegotiating a link speed between the compute node and the port, or redirecting data to another switch. The methods facilitate thermal control of a switch without its own thermal throttling capability.

Abstract: Automatically cooling computer system components for safe servicing includes: determining that a target component of a plurality of components is to be serviced; and reducing temperature of one or more components of said plurality of components if such one or more components exceeds a threshold temperature and such one or more components are within a predefined area of the target component.