Abstract: This invention relates to a removable grade hot melt pressure sensitive adhesive comprising from about 5% to about 30% by weight of the adhesive of a block copolymer having styrene endblocks and ethylene/butylene or ethylene/propylene midblocks and having a coupling efficiency of less than about 65% and a melt index of greater than about 20 grams/10 minutes; from about 10% to about 50% by weight of the adhesive of at least one block copolymer having styrene endblocks and a coupling efficiency from about 65% to about 100%; from about 20% to about 60% by weight of the adhesive of a tackifying resin and from about 10% to about 40% by weight of the adhesive of a liquid plasticizing oil.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: This invention relates to a hot melt adhesive composition in pellet form. The hot melt adhesive composition is pressure sensitive, having a storage modulus, G′, at 25° C., of less than about 5×106 dynes/cm2. The pellets are coated with a pelletizing aid on the surface at a concentration preferably ranging from about 1 wt-% to about 30 wt-%. The pelletizing aid is a hot melt adhesive component or a material which does not substantially adversely affect the adhesive properties.

Abstract: A hot melt pressure sensitive adhesive comprising a) from about 15% to about 40% by weight of a block copolymer having a coupling efficiency of less than about 75%; b) from about 20% to about 50% by weight of a tackifying resin selected from the group consisting of those tackifying resins having a softening point of less than about 100° C.; c) from about 30% to about 50% by weight of a plasticizing oil; and d) up to about 15% of a compatible polymer wherein the total polymer content does not exceed 40% by weight of the adhesive wherein the hot melt pressure sensitive adhesive fails cohesively during use.

Abstract: This invention relates to a hot melt adhesive composition in pellet form. The hot melt adhesive composition is pressure sensitive, having a storage modulus, G', at 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2. The pellets are coated with a pelletizing aid on the surface at a concentration preferably ranging from about 1 wt-% to about 30 wt-%. The pelletizing aid is a hot melt adhesive component or a material which does not substantially adversely affect the adhesive properties. The pellets are free-flowing and have a substantially tack-free surface.

Abstract: A removable grade hot melt pressure sensitive adhesive, comprising from about 10% to about 50% by weight of the adhesive of at least one styrene-isoprene-styrene block copolymer having a diblock content of greater than about 50% a melt index of less than about 30 grams/10 minutes; from about 10% to about 40% by weight of the adhesive of at least one tackifying resin having a softening point of less than about 120.degree. C. and from about 10% to about 50% by weight of the adhesive of a liquid plasticizer. The resultant adhesive has 180.degree. peel values to stainless steel of less than about 4.0 pounds per linear inch.

Abstract: A polymeric composition in pellet form comprising a tacky hot melt composition, comprising a) from about 5% by weight to about 90% by weight of a thermoplastic polymer, b) from about 0% by weight to about 65% by weight of a tackifying resin, c) from about 0% to about 50% by weight of a plasticizer, d) up to about 2% by weight of an antioxidant, and a pelletizing aid, wherein the tacky hot melt composition has some minimum amount of tackifier or plasticizer and is a pressure sensitive adhesive having a storage modulus, G', at about 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2, and each pellet has a substantially tack-free surface.This invention further discloses a polymeric composition in pellet form suitable for molding articles. The composition comprises a tacky hot melt composition comprising at least one high molecular weight triblock copolymer of the general configuration A-B-A and a plasticizer and a pelletizing aid.

Abstract: A hot melt adhesive composition comprising from about 5% to about 15% by weight of at least one radial styrene-isoprene-styrene block copolymer having the general configuration (pS--pI--pB).sub.n X wherein n is a number greater than 2, said block copolymer having a molecular weight from about 90,000 to about 380,000, and preferably from about 100,000 to about 250,000, and a styrene content from about 15% to about 35% by weight, and preferably from about 20% to about 30% by weight; up to about 10% of a compatible polymer, wherein the total polymer content does not exceed 15%; from about 30% to about 60% by weight of at least one compatible tackifying resin; from about 20% to about 40% by weight of at least one compatible plasticizer; and from about 0.1% to about 2% by weight stabilizer.

Abstract: This invention relates to a removable grade hot melt pressure sensitive adhesive comprising from about 5% to about 30% by weight of the adhesive of a block copolymer having styrene endblocks and ethylene/butylene or ethylene/propylene midblocks and having a coupling efficiency of less than about 65% and a melt index of greater than about 20 grams/10 minutes; from about 10% to about 50% by weight of the adhesive of at least one block copolymer having styrene endblocks and a coupling efficiency from about 65% to about 100%; from about 20% to about 60% by weight of the adhesive of a tackifying resin and from about 10% to about 40% by weight of the adhesive of a liquid plasticizing oil.

Abstract: This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.

Abstract: A polymeric composition in pellet form comprising a tacky hot melt composition, comprising a) from about 5% by weight to about 90% by weight of a thermoplastic polymer, b) from about 0% by weight to about 65% by weight of a tackifying resin, c) from about 0% to about 50% by weight of a plasticizer, d) up to about 2% by weight of an antioxidant, and a pelletizing aid, wherein the tacky hot melt composition has some minimum amount of tackifier or plasticizer and is a pressure sensitive adhesive having a storage modulus, G', at about 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2, and each pellet has a substantially tack-free surface.This invention further discloses a polymeric composition in pellet form suitable for molding articles. The composition comprises a tacky hot melt composition comprising at least one high molecular weight triblock copolymer of the general configuration A-B-A and a plasticizer and a pelletizing aid.

Abstract: This invention relates to hot melt adhesives comprising a high molecular weight polystyrene-ethylene/butylene-polystyrene block copolymer and articles constructed therefrom. This polymer is useful in a variety of hot melt adhesive applications such as food packaging adhesives, rodent traps, skin attachment adhesives, positioning adhesives, diaper tapes, low tack diaper fastening systems, foam in place gaskets, etc.

Abstract: A hot melt pressure sensitive adhesive comprising a) from about 15% to about 30% by weight of a linear styrene-ethylene/butylene-styrene copolymer having a styrene content from about 15% to about 35% by weight and a coupling efficiency of less than about 75%; b) from about 20% to about 50% by weight of a tackifying resin selected from the group consisting of those tackifying resins having a softening point of less than about 100.degree. C.; c) from about 30% to about 50% by weight of a plasticizing oil; and d) up to about 15% of a compatible polymer wherein the total polymer content does not exceed 30% by weight of the adhesive wherein the hot melt pressure sensitive adhesive fails cohesively during use.

Abstract: The invention relates to a PSA hot melt composition that exhibits adhesive stability when exposed to ultraviolet light and is stable when contacted with plasticized surfaces.