Abstract: An electrostatic substrate chucking system of the type having an electrostatic chuck for selectively retaining and selectively releasing a substrate. At least one sensor senses at least one parameter that is related to a degree to which electrostatic forces between the electrostatic chuck and the substrate have dissipated. Signals based on the at least one sensed parameter are sent from the sensor to a controller, which receives the signals and determines whether the electrostatic forces between the electrostatic chuck and the substrate have sufficiently dissipated so as to safely remove the substrate from the electrostatic chuck.

Abstract: An electrostatic chuck, disposed within a processing chamber, receives a substrate and signals to selectively grip and release the substrate. A radio frequency power supply creates and passes a first signal to a first path that passes it to a high pass filter. The high pass filter inhibits signals lower than a first frequency from passing to the radio frequency power supply through the first path, and passes the first signal to a second path. The second path passes the first signal to a first electrode in the processing chamber, which emits the first signal within the processing chamber. A second electrode is also disposed within the processing chamber. The second electrode receives a second signal, and emits the second signal within the processing chamber. The emission of the first and second signals creates a plasma from the environment within the processing chamber.