Abstract: A power electronics inverter includes a housing which forms a cold plate with coolant passages. The housing encloses an insulated gate bipolar transistor (IGBT), and a DC Link capacitor. The capacitor comprises a bus-bar which exits from a bottom side of the capacitor, and the bus-bar is positioned adjacent to the cold plate. The cold plate forms a cooling passage which underlies the IGBT and the capacitor bus-bar. Thermally conductive gap pads are located between the capacitor bus-bar and the cold plate.

Abstract: A power electronics inverter includes a housing which forms a cold plate with coolant passages. The housing encloses an insulated gate bipolar transistor (IGBT), and a DC Link capacitor. The capacitor comprises a bus-bar which exits from a bottom side of the capacitor, and the bus-bar is positioned adjacent to the cold plate. The cold plate forms a cooling passage which underlies the IGBT and the capacitor bus-bar. Thermally conductive gap pads are located between the capacitor bus-bar and the cold plate.

Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector and a second printed circuit board having a second edge connector. The first edge connector includes a plurality of fingers, with each finger having at least one first conductor pad. The second edge connector includes a plurality of openings positioned generally in line with each other and a plurality of second conductor pads. Each opening has a corresponding finger positioned therein. Each second conductor pad is positioned adjacent a corresponding opening and corresponding first conductor pad.

Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector, and a second printed circuit board having a second edge connector and a plurality of holes positioned in relation to the second edge connector. A pair of circuit board carriers mount the first printed circuit board generally perpendicular to the second printed circuit board. Each circuit board carrier is positioned at an opposite lateral edge of the first printed circuit board. Each circuit board carrier includes a flat base for abutting the second circuit board, and a pair of wings on laterally opposite sides of the base. Each wing includes a snap-in feature for snap engagement with a corresponding hole in the second circuit board. At least one slot guide retains a corresponding lateral edge of the first printed circuit board. A retainer at an end generally opposite the base retains a distal edge of the first printed circuit board.

Abstract: An electronic assembly comprises a generally planar substrate. An electronic component is mounted to the substrate and has a projecting portion projecting above a surface of the substrate. An enclosure has at least one side with indentations. One of the indentations is positioned to receive the projecting portion of the electronic component with a clearance gap. A thermally-conductive material is inserted between the projecting portion and the enclosure within the clearance gap.

Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector and a second printed circuit board having a second edge connector. The first edge connector includes a plurality of fingers, with each finger having at least one first conductor pad. The second edge connector includes a plurality of openings positioned generally in line with each other and a plurality of second conductor pads. Each opening has a corresponding finger positioned therein. Each second conductor pad is positioned adjacent a corresponding opening and corresponding first conductor pad.

Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector, and a second printed circuit board having a second edge connector and a plurality of holes positioned in relation to the second edge connector. A pair of circuit board carriers mount the first printed circuit board generally perpendicular to the second printed circuit board. Each circuit board carrier is positioned at an opposite lateral edge of the first printed circuit board. Each circuit board carrier includes a flat base for abutting the second circuit board, and a pair of wings on laterally opposite sides of the base. Each wing includes a snap-in feature for snap engagement with a corresponding hole in the second circuit board. At least one slot guide retains a corresponding lateral edge of the first printed circuit board. A retainer at an end generally opposite the base retains a distal edge of the first printed circuit board.