Patents by Inventor Jeffrey Scott Erlbaum

Jeffrey Scott Erlbaum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9603574
    Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: March 28, 2017
    Assignee: General Electric Company
    Inventors: James Wilson Rose, Donna Marie Sherman, Jeffrey Scott Erlbaum
  • Publication number: 20160183365
    Abstract: The present disclosure relates to the fabrication of electrical components and, in particular to the use of a reconfigurable substrate to which a flexible circuit may be affixed. In certain embodiments, the reconfigurable substrate may be moved between different configurations, certain of which are suitable for fabrication and certain of which are suitable for operation.
    Type: Application
    Filed: December 17, 2014
    Publication date: June 23, 2016
    Inventors: James Wilson Rose, Donna Marie Sherman, Jeffrey Scott Erlbaum
  • Publication number: 20140216547
    Abstract: Thin film photovoltaic devices including a transparent substrate defining a front surface area; a photovoltaic thin film stack on the transparent substrate; and, a back panel defining a rear surface area are provided. The photovoltaic thin film stack is positioned between the transparent substrate and the back panel. The front surface area can be less than the rear surface area (e.g., about 90% to about 99.9% of the rear surface area). As such, the back panel can extend farther than the transparent substrate along at least one edge of the device. An encapsulant layer defining an encapsulant surface area can be positioned between the photovoltaic thin film stack and the back panel. The encapsulant surface area can be greater than or equal to the front surface area or can be less than or equal to the rear surface area.
    Type: Application
    Filed: February 4, 2013
    Publication date: August 7, 2014
    Applicant: PRIMESTAR SOLAR, INC.
    Inventors: Troy Alan Berens, Max William Reed, Jeffrey Scott Erlbaum, David W. Vernooy, Venkata Sai Rahul Chandra Abbaraju, Boaz Alperson
  • Publication number: 20130153029
    Abstract: Methods are generally provided for adhering a support insert within a connection aperture defined in an encapsulating substrate of a photovoltaic device that has a first lead. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulating substrate. The method can, in one particular embodiment, include threading the first lead through the connection aperture; and positioning a support insert within the connection aperture such that the first lead is still able to extend through the connection aperture. The support insert can generally define a channel within its construction that extends from a channel opening in the support insert to an exit port. An adhesive composition can be injected into the channel opening such that a first amount of the adhesive composition flows through the channel and out of the exit port to bond the support insert within the connection aperture.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: PRIMESTAR SOLAR, INC.
    Inventors: Bradley Crume, Max William Reed, Loucas Tsakalakos, Jeffrey Scott Erlbaum, Troy Alan Berens, Jeffrey Todd Knapp, Venkata Sai Rahul Chandra Abbaraju
  • Publication number: 20130153004
    Abstract: Photovoltaic devices are generally provided that can include, in one particular embodiment, a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and, an encapsulation substrate on the plurality of thin film layers. The encapsulation substrate can generally define a back surface and a connection aperture through which the first lead extends. A junction box can be positioned over the connection aperture and connected to the first lead. The junction box generally comprises a support member extending through the connection aperture to mechanically support the transparent substrate in an area opposite to the connection aperture. Methods and kits are also generally provided.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: PRIMESTAR SOLAR, INC.
    Inventors: Jeffrey Todd Knapp, Max William Reed, Loucas Tsakalakos, Jeffrey Scott Erlbaum
  • Publication number: 20130153002
    Abstract: Photovoltaic devices that include a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and an encapsulation substrate on the plurality of thin film layers are provided. The encapsulation substrate defines a connection aperture through which the first lead extends. A support insert, which defines a plug portion and a flange, can be positioned within the connection aperture such that the flange extends over the back surface of the encapsulation substrate. The support insert can be configured to mechanically support the transparent substrate in an area opposite to the connection aperture while still enabling the first lead to extend through the connection aperture while the support insert is in place within the connection aperture.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: PrimeStar Solar, Inc.
    Inventors: Max William Reed, Bradley Crume, Loucas Tsakalakos, Jeffrey Scott Erlbaum, Troy Alan Berens, Jeffrey Todd Knapp
  • Publication number: 20130153003
    Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate can be positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulation substrate. An adhesive plug can be positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. A back plate or back washer can also be bonded to the adhesive plug and/or back surface of the encapsulation substrate to help dissipate energy in and/or provide support to the encapsulation substrate. Methods are also provided for mechanically supporting a transparent substrate in an area opposite to a connection aperture defined in an encapsulation substrate.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: PRIMESTAR SOLAR, INC.
    Inventors: Troy Alan Berens, Bradley Crume, Loucas Tsakalakos, Jeffrey Scott Erlbaum, Max William Reed
  • Publication number: 20090256254
    Abstract: A semiconductor assembly includes a semiconductor wafer including backside contact pads coupled to respective contact regions of different signal types and insulation separating the backside contact regions by signal type. The semiconductor assembly further includes metallization situated over at least a portion of the insulation and interconnecting the backside contact pads.
    Type: Application
    Filed: April 10, 2008
    Publication date: October 15, 2009
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: William Edward Burdick, JR., Jeffrey Scott Erlbaum, Kaustubh Ravindra Nagarkar, Sandeep Shrikant Tonapi
  • Publication number: 20080318055
    Abstract: An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer is capable of releasing the base insulative layer from the electronic device. The removal may be done without damage to a predetermined part of the electronic component.
    Type: Application
    Filed: June 21, 2007
    Publication date: December 25, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Raymond Albert Fillion, David Richard Esler, Jeffrey Scott Erlbaum, Ryan Christopher Mills, Charles Gerard Woychik
  • Publication number: 20080318413
    Abstract: A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
    Type: Application
    Filed: June 21, 2007
    Publication date: December 25, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Raymond Albert Fillion, David Richard Esler, Jeffrey Scott Erlbaum, Ryan Christopher Mills, Charles Gerard Woychik
  • Patent number: 7451651
    Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: November 18, 2008
    Assignee: General Electric Company
    Inventors: Charles Gerard Woychik, Rayette Ann Fisher, David Martin Mills, Scott Cogan, David Richard Esler, Robert Gideon Wodnicki, Jeffrey Scott Erlbaum
  • Publication number: 20080134793
    Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
    Type: Application
    Filed: December 11, 2006
    Publication date: June 12, 2008
    Inventors: Charles Gerard Woychik, Rayette Ann Fisher, David Martin Mills, Scott Cogan, David Richard Esler, Robert Gideon Wodnicki, Jeffrey Scott Erlbaum