Abstract: Method, system, and computer program product embodiments of heating a flow of liquid by transfer of heat with computing devices. Embodiments also include determining a dynamic cooling capacity index for each of the computing devices, and allocating processing workload among the first computing device and the second computing device based on the dynamic cooling capacity indexes of the computing devices. Embodiments further include allocating workload and/or regulating flow rate of the flow of liquid to maintain a predetermined value or range of values of temperature of the liquid.

Abstract: Integrated Thermal Interface Detachment Mechanism for Inaccessible Interfaces are disclosed. According to an aspect, an exemplary device for an electronic component having a thermal interface material, comprising a heat sink configured to contact the thermal interface material and configured to heat transfer interface with the electronic component while the thermal interface material is in contiguous contact with both the heat sink and the electronic component, and a separator mechanism configured to advance a separator ram with respect to the heat sink and effect a force upon the thermal interface material, such that advancing the ram breaks the contiguous contact of the thermal interface material with at least one of the heat sink and the electronic component.

Abstract: Integrated Thermal Interface Detachment Mechanism for Inaccessible Interfaces are disclosed. According to an aspect, an exemplary device for an electronic component having a thermal interface material, comprising a heat sink configured to contact the thermal interface material and configured to heat transfer interface with the electronic component while the thermal interface material is in contiguous contact with both the heat sink and the electronic component, and a separator mechanism configured to advance a separator ram with respect to the heat sink and effect a force upon the thermal interface material, such that advancing the ram breaks the contiguous contact of the thermal interface material with at least one of the heat sink and the electronic component.

Abstract: Method, system, and computer program product embodiments of heating a flow of liquid by transfer of heat with computing devices. Embodiments also include determining a dynamic cooling capacity index for each of the computing devices, and allocating processing workload among the first computing device and the second computing device based on the dynamic cooling capacity indexes of the computing devices. Embodiments further include allocating workload and/or regulating flow rate of the flow of liquid to maintain a predetermined value or range of values of temperature of the liquid.

Abstract: Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Abstract: An apparatus for auxiliary cooling redundancy for components using an actuating fan pack includes a fan pack. The fan pack includes a fan positioned to provide a stream of air directed toward a component mounted in the server rack and the server rack includes components for a data system. The apparatus includes and a vertical drive configured to move the fan pack vertically to a position so air from the fan is directed toward the component. The apparatus includes a positioning controller configured to direct the vertical drive to move the fan pack to a front of a component in the server rack and configured to turn on the fans.

Abstract: Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Abstract: Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments are disclosed. According to an aspect, a method includes using a cool sink to transfer thermal energy from an environment. The method also includes using a thermal energy transfer device to transfer the thermal energy to liquid within a conduit. Further, the method includes transporting the liquid containing the transferred thermal energy away from the environment such that the thermal energy within the environment is reduced.

Abstract: Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments are disclosed. According to an aspect, a method includes using a cool sink to transfer thermal energy from an environment. The method also includes using a thermal energy transfer device to transfer the thermal energy to liquid within a conduit. Further, the method includes transporting the liquid containing the transferred thermal energy away from the environment such that the thermal energy within the environment is reduced.

Abstract: A system according to one embodiment includes a storage bay having a peripheral sidewall defining an interior dimensioned to receive a data storage device therein, at least one flap coupled to the peripheral sidewall, a retention mechanism configured to retain the at least one flap in the retracted position, and an electronic connector coupled to the retention mechanism and configured to pass control signals to the retention mechanism. The at least one flap is positionable between a retracted and deployed position. The at least one flap substantially blocks airflow through the interior of the peripheral sidewall when the at least one flap is in the deployed position, and does not significantly block airflow through the interior of the peripheral sidewall when the at least one flap is in the retracted position. The retention mechanism is electronically controllable to cause the at least one flap to move toward the deployed position.

Abstract: Systems, methods, and devices for adjusting content of communication between devices for concealing the content from others are disclosed. According to an aspect, a method may be implemented at a communications device including a user interface, a processor, and memory. The method includes receiving a communication for presentation on the communications device. Further, the method includes identifying at least one person located in proximity to the communications device. The method also includes determining a profile of a current user of the communications device. Further, the method includes adjusting content of the communication based on a comparison of a profile of the identified at least one person and the determined profile. The method also includes using the user interface to present the adjusted content to the current user.

Abstract: A system according to one embodiment includes a storage bay having a peripheral sidewall defining an interior dimensioned to receive a data storage device therein, at least one flap coupled to the peripheral sidewall, a retention mechanism configured to retain the at least one flap in the retracted position, and an electronic connector coupled to the retention mechanism and configured to pass control signals to the retention mechanism. The at least one flap is positionable between a retracted and deployed position. The at least one flap substantially blocks airflow through the interior of the peripheral sidewall when the at least one flap is in the deployed position, and does not significantly block airflow through the interior of the peripheral sidewall when the at least one flap is in the retracted position. The retention mechanism is electronically controllable to cause the at least one flap to move toward the deployed position.