Patents by Inventor Jeffrey Scott Williams

Jeffrey Scott Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220409025
    Abstract: This application discloses embodiments for a device contemplated for use by combat medics and first responders for rapid treatment of Zone 2 penetrating neck injuries. The device incorporates a support arm and an occlusion arm featuring an occluding head which is applied to the wound. In certain embodiments, the support arm is in the form of a detachable neck support which attaches to a laryngoscope blade.
    Type: Application
    Filed: June 29, 2022
    Publication date: December 29, 2022
    Inventors: Austin Joseph Ballentine, Lauren Mackenzie Edmonson, Timothy Lee Norman, Caleb Talbot Williams, Jeffrey Scott Williams
  • Publication number: 20220007546
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell
  • Patent number: 11178791
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: November 16, 2021
    Assignee: SCHNEIDER ELECTRIC USA, INC.
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell
  • Publication number: 20160330869
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Application
    Filed: December 30, 2013
    Publication date: November 10, 2016
    Applicant: SCHNEIDER ELECTRIC USA, INC.
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell