Patents by Inventor Jeffrey Steidle

Jeffrey Steidle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11353659
    Abstract: A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: June 7, 2022
    Assignee: Rochester Institute of Technology
    Inventors: Mario J. Ciminelli, Stefan Preble, Jeffrey Steidle, Paul Thomas
  • Publication number: 20200310034
    Abstract: A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.
    Type: Application
    Filed: March 30, 2020
    Publication date: October 1, 2020
    Applicant: Rochester Institute of Technology
    Inventors: Mario J. Ciminelli, Stefan Preble, Jeffrey Steidle, Paul Thomas
  • Patent number: 10629989
    Abstract: Phased array antenna system operated from a remote location. Operations at a radio hub location involve generating an RF signal and modulating with the RF signal a continuous wave optical carrier to produce a transmit modulated optical carrier (TMOC). Electronic control signal digital data is also generated at the radio hub to control an antenna beam pattern of an array antenna. The control signal digital data is used to modulate an optical carrier for generating a control signal modulated optical carrier (CSMOC). Both the TMOC and CSMOC are coupled to an optical fiber for communication to an antenna site remote from the radio hub location. At the antenna site, the CSMOC and TMOC are processed to recover the electronic control signal digital data and a plurality of transmit element level modulated RF (ELMRF) signals which are applied to array antenna elements.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: April 21, 2020
    Assignee: PRECISION OPTICAL TRANSCEIVERS INC.
    Inventors: Bryce Tennant, David M. Calhoun, Jeffrey A. Steidle
  • Patent number: 10598861
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 24, 2020
    Assignees: Indiana Integrated Circuits, LLC, MRSI Systems, LLC, Rochester Institute of Technology
    Inventors: Jason M. Kulick, Yi Qian, Stefan Preble, Jeffrey Steidle, Michael Fanto, Tian Lu
  • Publication number: 20200003955
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Application
    Filed: September 10, 2019
    Publication date: January 2, 2020
    Inventors: Jason M. Kulick, Yi Qian, Stefan Preble, Jeffrey Steidle, Michael Fanto, Tian Lu
  • Patent number: 10466418
    Abstract: The invention provides an apparatus for optical integrated on-chip generation of photon pairs as a building block to create entangled photon states required for quantum information processing. The invention provided a frequency selective optical coupling device which controls the transmission of light by varying the relative dimensions of otherwise symmetrical linear optical waveguides tangential to an annular optical waveguide, thereby controlling the coupling of light between the linear optical waveguides and the annular optical waveguide. Dimensional change of the optical waveguides is achieved by a heated medium in proximity of the optical waveguides and under electronic control.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: November 5, 2019
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Michael L. Fanto, Paul M. Alsing, Christopher C. Tison, Stefan F. Preble, Jeffrey A. Steidle
  • Patent number: 10409004
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: September 10, 2019
    Assignees: Indiana Integrated Circuits, LLC, MRSI Systems, LLC, Rochester Institute of Technology
    Inventors: Jason M. Kulick, Yi Qian, Stefan Preble, Jeffrey Steidle, Michael Fanto, Tian Lu
  • Publication number: 20190267708
    Abstract: Phased array antenna system operated from a remote location. Operations at a radio hub location involve generating an RF signal and modulating with the RF signal a continuous wave optical carrier to produce a transmit modulated optical carrier (TMOC). Electronic control signal digital data is also generated at the radio hub to control an antenna beam pattern of an array antenna. The control signal digital data is used to modulate an optical carrier for generating a control signal modulated optical carrier (CSMOC). Both the TMOC and CSMOC are coupled to an optical fiber for communication to an antenna site remote from the radio hub location. At the antenna site, the CSMOC and TMOC are processed to recover the electronic control signal digital data and a plurality of transmit element level modulated RF (ELMRF) signals which are applied to array antenna elements.
    Type: Application
    Filed: October 19, 2018
    Publication date: August 29, 2019
    Inventors: Bryce Tennant, David M. Calhoun, Jeffrey A. Steidle
  • Publication number: 20190250335
    Abstract: Disclosed is a method and system for passively aligning optical fibers (4), a first waveguide array (62), and a second waveguide array (42) using chip-to-chip vertical evanescent optical waveguides (44) and (64), that can be used with fully automated die bonding equipment. The assembled system (2, 30, 60) can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.
    Type: Application
    Filed: July 19, 2017
    Publication date: August 15, 2019
    Applicants: Indiana Integrated Circuits, LLC, Rochester Institute of Technology, MRSI Systems, LLC
    Inventors: Jason M. KULICK, Yi QIAN, Stefan PREBLE, Jeffrey STEIDLE, Michael FANTO, Tian LU
  • Publication number: 20190187380
    Abstract: Briefly stated, the invention provides an apparatus for quantum computing comprising optical integrated on-chip generation of photon pairs as building blocks to create entangled photon states which are detected as necessary for quantum information processing. The invention provided a frequency selective optical coupling device which controls the transmission of light by varying the relative dimensions of otherwise symmetrical linear optical waveguides tangential to an annular optical waveguide, thereby controlling the coupling of light between the linear optical waveguides and the annular optical waveguide. Dimensional change of the optical waveguides is achieved by a heated medium in proximity of the optical waveguides and under electronic control.
    Type: Application
    Filed: February 20, 2019
    Publication date: June 20, 2019
    Inventors: MICHAEL L. FANTO, PAUL M. ALSING, CHRISTOPHER C. TISON, STEFAN F. PREBLE, JEFFREY A. STEIDLE
  • Publication number: 20190146155
    Abstract: The invention provides an apparatus for optical integrated on-chip generation of photon pairs as a building block to create entangled photon states required for quantum information processing. The invention provided a frequency selective optical coupling device which controls the transmission of light by varying the relative dimensions of otherwise symmetrical linear optical waveguides tangential to an annular optical waveguide, thereby controlling the coupling of light between the linear optical waveguides and the annular optical waveguide. Dimensional change of the optical waveguides is achieved by a heated medium in proximity of the optical waveguides and under electronic control.
    Type: Application
    Filed: December 6, 2017
    Publication date: May 16, 2019
    Inventors: MICHAEL L. FANTO, PAUL M. ALSING, CHRISTOPHER C. TISON, STEFAN F. PREBLE, JEFFREY A. STEIDLE
  • Publication number: 20180335570
    Abstract: The invention provides an apparatus for optical integrated on-chip generation of photon pairs as a building block to create entangled photon states required for quantum information processing. The invention provided a frequency selective optical coupling device which controls the transmission of light by varying the relative dimensions of otherwise symmetrical linear optical waveguides tangential to an annular optical waveguide, thereby controlling the coupling of light between the linear optical waveguides and the annular optical waveguide. Dimensional change of the optical waveguides is achieved by a heated medium in proximity of the optical waveguides and under electronic control.
    Type: Application
    Filed: November 15, 2017
    Publication date: November 22, 2018
    Inventors: MICHAEL L. FANTO, PAUL M. ALSING, CHRISTOPHER C. TISON, STEFAN F. PREBLE, JEFFREY A. STEIDLE