Abstract: A new and improved multi-pin RF field replaceable mounting flange structure, to be mounted upon a RF hybrid assembly, comprises a predetermined arrangement of multi-pin coaxial electrical connectors integrally incorporated upon a single field replaceable mounting flange structure for enabling the connection of a plurality of coaxial cables onto a single field replaceable mounting flange structure such that the plurality of coaxial cables can be electrically connected in a more spatially efficient manner than has been previously capable of being achieved regardless of the particular number of coaxial electrical connectors being connected.

Abstract: An antenna assembly has incorporated therein an antenna radome element or component which has a substantially cup-shaped configuration and which is provided with a plurality of concentrically disposed rib members upon the interior surface portion thereof. The rib members serve to not only reinforce the antenna radome element or component across the entire diametrical extent thereof, but in addition, the centermost rib member provides a recessed region or pocket for accommodating or housing terminal wires of the balun printed circuit board. In this manner, the terminal wires of the balun printed circuit board can be accommodated while the overall antenna assembly exhibits low profile characteristics in order to resolve operational spatial constraints or limitations.

Abstract: An antenna assembly has incorporated therein an antenna radome element or component which has a substantially cup-shaped configuration and which is provided with a plurality of concentrically disposed rib members upon the interior surface portion thereof. The rib members serve to not only reinforce the antenna radome element or component across the entire diametrical extent thereof, but in addition, the centermost rib member provides a recessed region or pocket for accommodating or housing terminal wires of the balun printed circuit board. In this manner, the terminal wires of the balun printed circuit board can be accommodated while the overall antenna assembly exhibits low profile characteristics in order to resolve operational spatial constraints or limitations.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a VME or VME64X backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to connector center line distances equals the connector offset at the backplane.