Abstract: A method or system of spatial-phase locking a beam used in maskless lithography provides a fiducial grid with a single spatial-period, the fiducial grid being rotated at an angle with respect to a direction of scanning the beam; detects a signal generated in response to the beam being incident upon the fiducial grid; determines frequency components of the detected signal; and determines a two-dimensional location of the beam from phases of two determined fundamental frequency component. The method or system further determines a size of the beam from relative amplitudes of the determined fundamental and harmonic frequency components and/or determine a shape of the beam from relative amplitudes of the determined fundamental and harmonic frequency components. The method or system corrects a deflection of the beam in response to the determined two-dimensional location, and/or adjusts the size of the beam in response to the determined size, and/or adjusts the shape of the beam in response to the determined shape.

Abstract: A method is disclosed for forming an array of focusing elements for use in a lithography system. The method involves varying an exposure characteristic over an area to create a focusing element that varies in thickness in certain embodiments. In further embodiments, the method includes the steps of providing a first pattern via lithography in a substrate, depositing a conductive absorber material on the substrate, applying an electrical potential to at least a first portion of the conductive absorber material, leaving a second portion of the conductive material without the electrical potential, and etching the second portion of the conductive material to provide a first pattern on the substrate that is aligned with the first portion of the conductive absorber material.

Abstract: A method is disclosed for forming an array of focusing elements for use in a lithography system. The method involves varying an exposure characteristic over an area to create a focusing element that varies in thickness in certain embodiments. In further embodiments, the method includes the steps of providing a first pattern via lithography in a substrate, depositing a conductive absorber material on the substrate, applying an electrical potential to at least a first portion of the conductive absorber material, leaving a second portion of the conductive material without the electrical potential, and etching the second portion of the conductive material to provide a first pattern on the substrate that is aligned with the first portion of the conductive absorber material.

Abstract: A diffraction grating of non-uniform strength is introduced into an optical waveguide by modulating its width. The waveguide may be fabricated using one of several planar processing techniques. Varying the size, position, and/or thickness of the grating teeth provides the desired variation of grating strength. Certain functional variations of grating strength suppress side-lobe levels in the grating reflection and transmission spectra. This process, termed apodization, is necessary for precise wavelength filtering and dispersion compensation. If desired, different periodicity gratings can be introduced in each side of the waveguide, multiple periodicities can be superimposed, the grating can be angled with respect to the waveguide, and the grating period and phase can be varied.