Abstract: In one aspect, the present subject matter discloses a seal including a substrate material. The substrate material has a first portion having a first abradability and a second portion having a second abradability, the first abradability being different from the second abradability.

Abstract: A cooling system for use in regulating a temperature of a component is described herein. The cooling system includes a plurality of flow control assemblies that are defined across a sidewall of the component for channeling a cooling fluid across a surface of the sidewall. The plurality of flow control assemblies are configured to adjust a plurality of fluid flow characteristics of the cooling fluid. The plurality of flow control assemblies includes a first flow control assembly configured to adjust a first fluid flow characteristic, and at least a second flow control assembly configured to adjust a second fluid flow characteristic that is different than the first fluid flow characteristic.

Abstract: Methods and apparatus for performing an accelerated lifetime test on a photovoltaic device are provided. The method can include positioning a first photovoltaic device in a first holder adjacent to a light guide such that a transparent surface of the photovoltaic device faces the light guide, directing light emitted from a first light source into the light guide, and redirecting the light emitted from the first light source within the light guide to illuminate the transparent surface of the photovoltaic device.

Abstract: In one aspect, the present subject matter discloses a seal including a substrate material. The substrate material has a first portion having a first abradability and a second portion having a second abradability, the first abradability being different from the second abradability.

Abstract: Photovoltaic devices are provided that can include a transparent substrate defining a front surface; a plurality of thin film layers on an inner surface of the transparent substrate that is opposite of the front surface; a first lead connected to one of the photovoltaic cells defined by the plurality of thin film layers; an encapsulation substrate defining a connection aperture through which the first lead extends upon lamination of the encapsulation substrate and the transparent substrate together; and, a reinforcement element positioned on the front surface of the transparent substrate opposite from the connection aperture defined in the encapsulation substrate. Methods and kits are also provided for strengthening a photovoltaic device.

Abstract: Photovoltaic devices that include a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and an encapsulation substrate on the plurality of thin film layers are provided. The encapsulation substrate defines a connection aperture through which the first lead extends. A support insert, which defines a plug portion and a flange, can be positioned within the connection aperture such that the flange extends over the back surface of the encapsulation substrate. The support insert can be configured to mechanically support the transparent substrate in an area opposite to the connection aperture while still enabling the first lead to extend through the connection aperture while the support insert is in place within the connection aperture.

Abstract: Methods are generally provided for adhering a support insert within a connection aperture defined in an encapsulating substrate of a photovoltaic device that has a first lead. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulating substrate. The method can, in one particular embodiment, include threading the first lead through the connection aperture; and positioning a support insert within the connection aperture such that the first lead is still able to extend through the connection aperture. The support insert can generally define a channel within its construction that extends from a channel opening in the support insert to an exit port. An adhesive composition can be injected into the channel opening such that a first amount of the adhesive composition flows through the channel and out of the exit port to bond the support insert within the connection aperture.

Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate is positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture has a perimeter defined by an aperture wall of the encapsulation substrate. A support insert is positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. The support insert is configured such that the first lead is able to extend through the connection aperture while the support insert in place within the connection aperture. A kit is also provided that includes an encapsulation substrate defining a connection aperture; and, a support insert configured to be coupled within the connection aperture of the encapsulation substrate.

Abstract: Photovoltaic devices are generally provided that can include, in one particular embodiment, a transparent substrate; a plurality of thin film layers defining a plurality of photovoltaic cells connected in series to each other on the transparent substrate; a first lead connected to one of the photovoltaic cells; and, an encapsulation substrate on the plurality of thin film layers. The encapsulation substrate can generally define a back surface and a connection aperture through which the first lead extends. A junction box can be positioned over the connection aperture and connected to the first lead. The junction box generally comprises a support member extending through the connection aperture to mechanically support the transparent substrate in an area opposite to the connection aperture. Methods and kits are also generally provided.

Abstract: A cooling system for use in regulating a temperature of a component is described herein. The cooling system includes a plurality of flow control assemblies that are defined across a sidewall of the component for channeling a cooling fluid across a surface of the sidewall. The plurality of flow control assemblies are configured to adjust a plurality of fluid flow characteristics of the cooling fluid. The plurality of flow control assemblies includes a first flow control assembly configured to adjust a first fluid flow characteristic, and at least a second flow control assembly configured to adjust a second fluid flow characteristic that is different than the first fluid flow characteristic.

Abstract: Apparatus for vapor deposition of a sublimated source material as a thin film on a photovoltaic module substrate is generally provided. The apparatus can include a deposition head; a distribution plate disposed below said distribution manifold and above an upper surface of a substrate transported through said apparatus and defining a pattern of passages therethrough; and, a carrying mechanism configured to transport the substrate in a machine direction under the distribution plate such that an upper surface of the substrate defines an arc in a cross-direction that is substantially perpendicular to the machine direction. Processes are also generally provided for vapor deposition of a sublimated source material to form thin film on a photovoltaic module substrate.

Abstract: Methods are generally disclosed for forming a thin film photovoltaic device. According to one embodiment, a transparent conductive oxide layer and an oxygen getter layer can be formed on a transparent substrate. The transparent conductive oxide layer and the oxygen getter layer can then be annealed together such that oxygen atoms move from the transparent conductive oxide layer into the oxygen getter layer. A photovoltaic heterojunction can be formed on the TCO layer. Thin film photovoltaic devices are also generally disclosed.