Patents by Inventor Jeffrey Toh Tuck Fook

Jeffrey Toh Tuck Fook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array chip packages having improved testing and stacking characteristics
    Publication number: 20020043986
    Abstract: A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned in and tested in a more efficient and cost effective manner than prior known BGA or FBGA semiconductor packages. A high density, low profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.
    Type: Application
    Filed: November 13, 2001
    Publication date: April 18, 2002
    Inventors: Wuu Yean Tay, Jeffrey Toh Tuck Fook