Abstract: Devices and methods to effectuate closed loop electrical stimulation of nerve tissue, based on feedback data, to mitigate pain of a patient are disclosed. Feedback data corresponding to bioelectric signals of neurons stimulated by stimulation pulses may be received and analyzed. Based on receipt of the feedback data, it may be determined to modify one or more stimulation parameters, corresponding to the stimulation pulses, to enhance an efficacy of the stimulation pulses at blocking generation and/or propagation of one or more pain signals through a neuroanatomy of the patient. Subsequent and additional stimulation pulses may be provided based on a modified set of stimulation parameters and configured to enhance attenuation of generation and/or transmission of pain signals through the neuroanatomy of the patient to ultimately reduce a level of pain experienced by the patient.

Abstract: The present disclosure provides systems and methods for a conductor assembly for an implantable lead cable. The conductor assembly includes a conductive element extending over an axial length from a proximal end to a distal end. The conductor assembly includes an inner dielectric layer coaxially covering the conductive element over the axial length. The conductor assembly includes an inner conductive layer coaxially covering the inner dielectric layer over the axial length, the inner conductive layer comprising a contiguous metal coating having a thickness in a range of 1 to 50 microns.

Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Abstract: An implantable medical lead may include a lead body, a substrate, and an elastic deflection component. The lead body includes a proximal end configured to couple to an implantable pulse generator, a distal end opposite the proximal end, and an electrical conductor extending through the lead body. The substrate is at the distal end and supports an array of electrodes. The elastic deflection component physically and electrically connects the electrical conductor and an electrode of the array of electrodes. The elastic deflection component is configured to compensate for at least one of tension forces or compression forces transferred from the electrical conductor to the electrode of the array of electrodes.

Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Abstract: Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.

Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Abstract: Disclosed herein is an implantable medical lead. The implantable medical lead may include a lead body, a substrate, and an elastic deflection component. The lead body includes a proximal end configured to couple to an implantable pulse generator, a distal end opposite the proximal end, and an electrical conductor extending through the lead body. The substrate is at the distal end and supports an array of electrodes. The elastic deflection component physically and electrically connects the electrical conductor and an electrode of the array of electrodes. The elastic deflection component is configured to compensate for at least one of tension forces or compression forces transferred from the electrical conductor to the electrode of the array of electrodes.

Abstract: Implementations described and claimed herein provide implantable electronic devices having a thin film feedthrough and methods of manufacturing the same. In one implementation, an implantable electronic device includes a housing enclosing one or more internal electronic components within a hermetic environment. A feedthrough port is defined in a wall of the housing. A thin film feedthrough has a feedthrough body extending through the feedthrough port. The feedthrough body provides one or more electrical pathways between external contacts and internal contacts. The external contacts are disposed outside the hermetic environment, and the internal contacts are electrically connected to the one or more internal electronic components at an internal connection junction. A hermetic junction is disposed in the feedthrough port isolating the thin film feedthrough from the housing.

Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Abstract: A hemostatic plug for sealing wounds in blood vessels comprising a tubular or spring-like body capable of buckling or collapsing upon application of a threshold axial force and having a fretted distal end. A collapsed portion of the plug lodges into the tissue tract and thus acts as a foothold allowing the plug to maintain continuous pressure on the puncture site necessary for a quick effective closure of the wound. Furthermore, collapse of the plug minimizes the chance of arterial penetration.

Abstract: A hemostatic plug for sealing wounds in blood vessels comprising a tubular or spring-like body capable of buckling or collapsing upon application of a threshold axial force and having a fretted distal end. A collapsed portion of the plug lodges into the tissue tract and thus acts as a foothold allowing the plug to maintain continuous pressure on the puncture site necessary for a quick effective closure of the wound. Furthermore, collapse of the plug minimizes the chance of arterial penetration.

Abstract: An insertion guide wire with an anchor formed in the distal end for precisely locating a subcutaneous arterial wound and guiding a plug of hemostatic material thereto. When the hemostatic material is properly placed, the anchor can be released and the guide wire removed, leaving no foreign object in the lumen of the artery.

Abstract: An insertion guide wire with an anchor formed in the distal end for precisely locating a subcutaneous arterial wound and inserting a guide sheath adjacent to said arterial wound. The hemostatic material can then be placed outside the wound. When the guide sheath is properly placed, the anchor can be released and the guide wire removed. The hemostatic material can then be placed outside the wound, leaving no foreign object in the lumen of the artery.

Abstract: An insertion guide wire with an anchor formed in the distal end for precisely locating a subcutaneous arterial wound and guiding a plug of hemostatic material thereto. When the hemostatic material is properly placed, the anchor can be released and the guide wire removed, leaving no foreign object in the lumen of the artery.