Patents by Inventor Jeffrey Voss

Jeffrey Voss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230218911
    Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
    Type: Application
    Filed: March 22, 2023
    Publication date: July 13, 2023
    Inventors: Andrew J. Ries, Chunho Kim, Robert A. Munoz, Christopher T. Kinsey, Jeffrey Voss, Kris A. Peterson, Mark E. Henschel
  • Patent number: 11633611
    Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 25, 2023
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Chunho Kim, Robert A. Munoz, Christopher T. Kinsey, Jeffrey Voss, Kris A. Peterson, Mark E. Henschel
  • Publication number: 20210187307
    Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
    Type: Application
    Filed: December 17, 2020
    Publication date: June 24, 2021
    Inventors: Andrew J. Ries, Chunho Kim, Robert A. Munoz, Christopher T. Kinsey, Jeffrey Voss, Kris A. Peterson, Mark E. Henschel
  • Publication number: 20050147610
    Abstract: The present invention encompasses IL-18 binding proteins, particularly antibodies that bind human interleukin-18 (hIL-18). Specifically, the invention relates to antibodies that are entirely human antibodies. Preferred antibodies have high affinity for hIL-18 and/or that neutralize hIL-18 activity in vitro and in vivo. An antibody of the invention can be a full-length antibody or an antigen-binding portion thereof. Method of making and method of using the antibodies of the invention are also provided. The antibodies, or antibody portions, of the invention are useful for detecting hIL-18 and for inhibiting hIL-18 activity, e.g., in a human subject suffering from a disorder in which hIL-18 activity is detrimental.
    Type: Application
    Filed: November 12, 2004
    Publication date: July 7, 2005
    Inventors: Tariq Ghayur, Boris Labkovsky, Jeffrey Voss, Larry Green, John Babcook, Xiao-chi Jia, James Wieler, Jaspal Kang, Brad Hedberg
  • Publication number: 20050100965
    Abstract: The present invention encompasses IL-18 binding proteins, particularly antibodies that bind human interleukin-18 (hIL-18). Specifically, the invention relates to antibodies that are entirely human antibodies. Preferred antibodies have high affinity for hIL-18 and/or that neutralize hIL-18 activity in vitro and in vivo. An antibody of the invention can be a full-length antibody or an antigen-binding portion thereof. Method of making and method of using the antibodies of the invention are also provided. The antibodies, or antibody portions, of the invention are useful for detecting hIL-18 and for inhibiting hIL-18 activity, e.g., in a human subject suffering from a disorder in which hIL-18 activity is detrimental.
    Type: Application
    Filed: November 12, 2003
    Publication date: May 12, 2005
    Inventors: Tariq Ghayur, Boris Labkovsky, Jeffrey Voss, Larry Green, John Babcook, Xiao-chi Jia, James Wieler, Jaspal Kang, Brad Hedberg