Patents by Inventor Jeffrey William Reed

Jeffrey William Reed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210299667
    Abstract: A photonic thermocycling device is configured to thermocycle a biological sample. The thermocycling device comprises a light source configured to emit an illumination beam, a reaction block holding a reaction chamber, and a light-absorbing film is coupled to the reaction block and configured to absorb and convert the illumination beam into thermal energy to heat the reaction chamber. A controller generates instructions for operation of the thermocycling device. The thermocycling device may further comprise a temperature sensor to measure the temperature of the reaction chamber for calibration of the instructions. A convection cooling element may also be implemented to provide rapid cooling of the reaction chamber. A lens assembly may be implemented for directing and conditioning light generated by the light source towards the light-absorbing film. A second partial light-absorbing film may be included and coupled on an opposite side of the first light-absorbing film, to improve heating uniformity.
    Type: Application
    Filed: March 24, 2021
    Publication date: September 30, 2021
    Inventors: Weidong Cao, Trevor Sierra Foss, Brandy Michelle Baird, Jeffrey William Reed, Mark Frederick Senko, Andrea W. Chow
  • Publication number: 20210237079
    Abstract: A system for characterization and counting of molecules and/or polymers includes: a base substrate; an electrode layer configured to route one or more electrodes for applying; a chip 130 coupled to the electrode layer and configured to mate with a recessed portion of the base substrate; a sealing layer positioned adjacent to the electrode layer; a second substrate positioned adjacent to the sealing layer; and a set of fasteners coupling the second substrate, the sealing layer, the electrode layer, the chip, and the base substrate together as an assembly. Embodiments of the system can be used for molecular quantification, sizing, and characterization of DNA, RNA, and polymers, as well as characterization of macromolecular interactions (e.g., DNA-protein interactions, RNA-protein interactions, protein-protein interactions). Methods of manufacturing and applications of the system are also described.
    Type: Application
    Filed: December 23, 2020
    Publication date: August 5, 2021
    Inventors: Erik Henry Tews, Reto Stamm, Jeffrey William Reed