Abstract: Embodiments of the present invention provide a method of preventing electrical shorting of adjacent semiconductor devices. The method includes forming a plurality of fins of a plurality of field-effect-transistors on a substrate; forming at least one barrier structure between a first and a second fin of the plurality of fins; and growing an epitaxial film from the plurality of fins, the epitaxial film extending horizontally from sidewalls of at least the first and second fins and reaching the barrier structure situating between the first and second fins.

Abstract: Embodiments of the present invention provide a method of preventing electrical shorting of adjacent semiconductor devices. The method includes forming a plurality of fins of a plurality of field-effect-transistors on a substrate; forming at least one barrier structure between a first and a second fin of the plurality of fins; and growing an epitaxial film from the plurality of fins, the epitaxial film extending horizontally from sidewalls of at least the first and second fins and reaching the barrier structure situating between the first and second fins.

Abstract: A device and method for selective placement of charge into a gate stack includes forming gate stacks including a gate dielectric adjacent to a transistor channel and a gate conductor and forming doped regions for transistor operation. A layer rich in a passivating element is deposited over the doped regions and the gate stack, and the layer rich the passivating element is removed from selected transistors. The layer rich in the passivating element is than annealed to drive-in the passivating element to increase a concentration of charge at or near transistor channels on transistors where the layer rich in the passivating element is present. The layer rich in the passivating element is removed.

Abstract: A device and method for selective placement of charge into a gate stack includes forming gate stacks including a gate dielectric adjacent to a transistor channel and a gate conductor and forming doped regions for transistor operation. A layer rich in a passivating element is deposited over the doped regions and the gate stack, and the layer rich the passivating element is removed from selected transistors. The layer rich in the passivating element is than annealed to drive-in the passivating element to increase a concentration of charge at or near transistor channels on transistors where the layer rich in the passivating element is present. The layer rich in the passivating element is removed.

Abstract: A device and method for selective placement of charge into a gate stack includes forming gate stacks including a gate dielectric adjacent to a transistor channel and a gate conductor and forming doped regions for transistor operation. A layer rich in a passivating element is deposited over the doped regions and the gate stack, and the layer rich the passivating element is removed from selected transistors. The layer rich in the passivating element is than annealed to drive-in the passivating element to increase a concentration of charge at or near transistor channels on transistors where the layer rich in the passivating element is present. The layer rich in the passivating element is removed.

Abstract: A field effect transistor structure having: a first type conductivity semiconductor body disposed on an insulator and having formed in different regions thereof: (a) a source region; (b) a drain region, such source and drain regions being of a conductivity type opposite the conductivity type of the body; (c) a gate electrode adapted to control a flow of carriers in a channel through the semiconductor body between the source and drain regions; and (d) a Schottky contact region providing a Schottky diode between the semiconductor body and one of the source and drain regions. With such an arrangement, the Schottky diode, when forward biased provides a fixed voltage, about 0.3 V, between the semiconductor body and one of the source and drain regions.

Abstract: A field effect transistor structure having a first type conductivity semiconductor body disposed on an insulator and having formed in different regions of the semiconductor, a source region and a drain region of the opposite type conductivity to the first type, a gate electrode adapted to control a flow of carriers in a channel through the semiconductor body between the source and drain regions, and a Schottky diode contact region between the semiconductor body and one of the source or the drain regions. With such an arrangement, the Schottky diode, when forward biased provides a fixed voltage, about 0.3 volts, between the semiconductor body and one of the source or the drain regions.