Abstract: Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.

Abstract: This invention pertains to bonded composites, and absorbent articles comprising such bonded composites. The bonded composites comprise first and second layers of thin-section sheet material bonded by bond elements defining a bond pattern. The bond pattern has a length, and width. The bond pattern includes a first sub-array of longitudinally-oriented separate and distinct stress receptor elements proximate the side edges, and spaced at first distances from each other, and a second sub-array of longitudinally-oriented separate and distinct transfer and dissipation elements preferably disposed inwardly of the side edges and inwardly of the stress receptor elements, and at second distances from the stress receptor elements less than spacing of the stress receptor elements from each other. Bonds can be activated by application of thermal or ultrasonic energy, or pressure e.g. against adhesive.

Abstract: Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.

Abstract: Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material.

Abstract: Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.

Abstract: Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.