Abstract: The present invention relates to methods of delayering a semiconductor integrated circuit die or wafer. In at least one aspect, the method includes exposing a die or wafer to plasma of an etching gas and detecting exposure of one or more metal layers within the die. In one aspect of the invention, the plasma of the etching gas is non-selective and removes all materials in a layer at about the same rate. In another aspect of the invention, two different plasmas of corresponding etching gases are employed with each plasma of the etching gas being selective, thus necessitating the sequential use of both plasmas of corresponding etching gases to remove all materials in a layer.

Abstract: The present invention relates to methods of delayering a semiconductor integrated circuit die or wafer. In at least one aspect, the method includes exposing a die or wafer to plasma of an etching gas and detecting exposure of one or more metal layers within the die. In one aspect of the invention, the plasma of the etching gas is non-selective and removes all materials in a layer at about the same rate. In another aspect of the invention, two different plasmas of corresponding etching gases are employed with each plasma of the etching gas being selective, thus necessitating the sequential use of both plasmas of corresponding etching gases to remove all materials in a layer.

Abstract: An integrating impact switch that can discriminate between accelerations due to different stimuli is provided. Embodiments of the present invention actuate only in response to an acceleration whose magnitude is equal to or greater than an acceleration threshold for a predetermined continuous period of time. Embodiments of the present invention comprise an impact switch having a throw that is operatively coupled with a viscous damper that dampens motion of the throw. As a result, a stimulus that imparts an acceleration that meets or exceeds an acceleration threshold for a time period less than a predetermined time-period threshold does not actuate the switch. A stimulus that imparts an acceleration whose magnitude is equal to or greater than the acceleration threshold for a time period equal to the time-period threshold, however, does actuate the switch.

Abstract: An integrating impact switch that can discriminate between accelerations due to different stimuli is provided. Embodiments of the present invention actuate only in response to an acceleration whose magnitude is equal to or greater than an acceleration threshold for a predetermined continuous period of time. Embodiments of the present invention comprise an impact switch having a throw that is operatively coupled with a viscous damper that dampens motion of the throw. As a result, a stimulus that imparts an acceleration that meets or exceeds an acceleration threshold for a time period less than a predetermined time-period threshold does not actuate the switch. A stimulus that imparts an acceleration whose magnitude is equal to or greater than the acceleration threshold for a time period equal to the time-period threshold, however, does actuate the switch.

Abstract: An integrating impact switch that can discriminate between accelerations due to different stimuli is provided. Embodiments of the present invention actuate only in response to an acceleration whose magnitude is equal to or greater than an acceleration threshold for a predetermined continuous period of time. Embodiments of the present invention comprise an impact switch having a throw that is operatively coupled with a viscous damper that dampens motion of the throw. As a result, a stimulus that imparts an acceleration that meets or exceeds an acceleration threshold for a time period less than a predetermined time-period threshold does not actuate the switch. A stimulus that imparts an acceleration whose magnitude is equal to or greater than the acceleration threshold for a time period equal to the time-period threshold, however, does actuate the switch.

Abstract: An integrating impact switch that can discriminate between accelerations due to different stimuli is provided. Embodiments of the present invention actuate only in response to an acceleration whose magnitude is equal to or greater than an acceleration threshold for a predetermined continuous period of time. Embodiments of the present invention comprise an impact switch having a throw that is operatively coupled with a viscous damper that dampens motion of the throw. As a result, a stimulus that imparts an acceleration that meets or exceeds an acceleration threshold for a time period less than a predetermined time-period threshold does not actuate the switch. A stimulus that imparts an acceleration whose magnitude is equal to or greater than the acceleration threshold for a time period equal to the time-period threshold, however, does actuate the switch.

Abstract: A cutting blade (56) having a cutting edge (80) defined by an intersection of a first cutting edge surface (72) and a second cutting edge surface (66) is disclosed. The angle between the first cutting edge surface (72) and the second cutting edge surface (66) defines a blade angle (?). The blade (56) may be fabricated from a wafer (130) by an anisotropic etch. An upper surface (134) of the wafer (130) is defined by a first set of 3 Miller indices, where at least one individual Miller index of this first set has an absolute value greater than 3. A top surface (60) of the blade (56) is defined by part of the upper surface (134) of the wafer (130). The anisotropic etch proceeds until reaching a particular crystallographic plane to define the first cutting edge surface (72). Having the top surface (60) of the blade (56) defined by the noted set of 3 Miller indices increases the potential that a blade angle (?) of a desired magnitude may be realized.

Abstract: A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Abstract: The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: A blade separation fixture (300) is disclosed. A wafer (130) is positioned on the fixture (300). This wafer (130) includes a plurality of cutting blades (56) that are initially spaced above the fixture (300). Blade handles (24) will typically already have been mounted on each of the various cutting blades (56) at this time. In any case, each of the various cutting blades (56) are separated from the wafer (130) by applying an appropriate downwardly directed force. Separated blades (56) in effect pivot into an inclined position against the fixture (300) without having their corresponding cutting edges (80) contact the fixture (300).

Abstract: A cutting tool (20) for a microkeratome (4) is disclosed. This cutting tool (20) includes a blade handle (24) and a separate cutting blade (56). Both the blade handle (24) and cutting blade (56) include features to register or align a cutting edge (80) of the cutting blade (56) with a microkeratome registration surface (28) of the blade handle (24). This microkeratome registration surface (28) of the blade handle (24) interfaces with a cutting tool registration surface (14) of a head assembly (10) of the microkeratome (4) on which the cutting tool (20) is installed. Therefore, the cutting edge (80) of the cutting blade (56) is registered or aligned relative to the cutting tool registration surface (14) of the head assembly (10) of the microkeratome (4).

Abstract: A microkeratome blade (54) that that is fabricated from a wafer (130) is disclosed. The blade (54) includes a notch (110) on its rear surface (106). During fabrication of the blade (54) from the wafer (130), a blade support tab (131) provides a structural interconnection between the wafer (130) and the blade (56). This blade support tab (131) extends within the notch (110) and merges with the blade (56). A score (132) extends across at least part of the blade support tab (131) to facilitate separation of the blade (56) from the wafer (130) by fracturing or the like. This score (132) is positioned such that the surface defined by separating the blade (56) from the wafer (130) at least generally along the score (132) is “disposed within” the notch (110) or recessed relative to a rearwardmost portion of the rear surface (106) of the blade (56).

Abstract: A method for fabricating a cutting blade (56) from a wafer (130) is disclosed. The wafer (130) is etched to define part of the perimeter of the blade (56). This etch also defines a blade support (131) that maintains a structural interconnection between the blade (56) and the wafer (130). A score (132) is formed across at least part of the blade support tab (131). Fracturing the blade support tab (131) at least generally along the score (132) at some point in time after the completion of the etch facilitates the separation of the blade (56) from the wafer (130).

Abstract: A cutting blade (56) having a cutting edge (80) defined by an intersection of a first cutting edge surface (72) and a second cutting edge surface (66) is disclosed. The angle between the first cutting edge surface (72) and the second cutting edge surface (66) defines a blade angle (&thgr;). The blade (56) may be fabricated from a wafer (130) by an anisotropic etch. An upper surface (134) of the wafer (130) is defined by a first set of 3 Miller indices, where at least one individual Miller index of this first set has an absolute value greater than 3. A top surface (60) of the blade (56) is defined by part of the upper surface (134) of the wafer (130). The anisotropic etch proceeds until reaching a particular crystallographic plane to define the first cutting edge surface (72). Having the top surface (60) of the blade (56) defined by the noted set of 3 Miller indices increases the potential that a blade angle (&thgr;) of a desired magnitude may be realized.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.