Abstract: A heat sink coupling device, specifically a heat sink coupling device utilized to cool and reduce the temperature of a central processing unit in a computer, comprised of a coupling base, the top surface of which provides for the selectable installation of a wide range of different specification cooling fans, latch arms extending downward from the four corners of the coupling base, a curved hook formed at the bottom end of each latch arm, and elastic elements at the two sides of the coupling base that are punched formed into a projecting, free-floating state. Given the foregoing structure, the heat sink coupling device of the present invention conveniently affords the flexible installation of a wide range of different specification cooling fans, while the operating personnel completes the installation of a cooling fan preassembled to a heat sink element onto the heat dissipation element clip mount in a single step, thereby increasing assembly efficiency and practical functionality.